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NB100LVEP221MNRG

Onsemi

NB100LVEP221MNRG by Onsemi

NB100LVEP221MNRG clock driver by Onsemi features a propagation delay of 0.71 ns, operating temperature range of -40 to 85 °C, and 52 terminals in a square package. It is ideal for applications requiring differential mux input conditioning, with ECL technology and industrial temperature grade suitability.

Median Price

$44.405

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,918 parts In-Stock

1+ parts

$22.110

100+ parts

$15.392

1k+ parts

$14.467

10k+ parts

$13.945

1,918

$22.110

$15.392

$14.467

$13.945

Chip1Stop

Japan . 1,666 parts In-Stock

1+ parts

$66.700

100+ parts

$31.200

1k+ parts

$20.800

10k+ parts

-

1,666

$66.700

$31.200

$20.800

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 298 parts In-Stock

1+ parts

$21.147

100+ parts

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298

$21.147

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Vyrian

USA . 63 parts In-Stock

1+ parts

$22.260

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63

$22.260

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Chip Stock

USA . 3,500 parts In-Stock

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3,500

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,049 parts In-Stock

1+ parts

$20.034

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1,049

$20.034

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Corohmni

South Africa . 109 parts In-Stock

1+ parts

$22.260

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109

$22.260

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$23.712

100+ parts

$21.578

1k+ parts

$19.444

10k+ parts

-

500

$23.712

$21.578

$19.444

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Microchip USA

USA . 3,281 parts In-Stock

1+ parts

$39.394

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3,281

$39.394

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Perfect Parts

USA . 9,448 parts In-Stock

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SupplyDigital Components

Austria . 7,421 parts In-Stock

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Kulean Microsystems

USA . 6,363 parts In-Stock

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6,363

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Problanco Electronics

Mexico . 4,598 parts In-Stock

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TANS Electronics

Latvia . 2,058 parts In-Stock

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Authorized Procurement Solutions

USA . 1,796 parts In-Stock

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GreenTree Electronics

Israel . 1,786 parts In-Stock

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iodParts Technologies Inc.

India . 1,686 parts In-Stock

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Futuretech Components

Singapore . 1,091 parts In-Stock

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UHIMA Technologies

Türkiye . 356 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NB100LVEP221MNRG clock driver & buffer from Onsemi. Designed with precision and reliability in mind, this product delivers exceptional quality and durability. Ideal for a wide range of applications, this clock driver ensures seamless operation and enhanced efficiency. Trust in the expertise of Onsemi to provide you with top-notch solutions that will elevate your projects to new heights. Upgrade your designs today with the NB100LVEP221MNRG and experience the difference!

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort in the manufacturing process.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a nominal supply voltage of 2.5V makes this product suitable for a wide range of applications and ensures compatibility with various systems.

Propagation Delay (tpd): 0.71 ns

The low propagation delay of only 0.71ns ensures fast and precise signal transmission, making this product ideal for high-speed applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand harsh environmental conditions and maintain reliable performance.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 85 °C ensures that this product remains functional in both extreme cold and heat.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates that this product has a moderate level of moisture sensitivity, making it suitable for storage and handling in typical manufacturing environments.

Technical Specifications

Clock Drivers & Buffers NB100LVEP221MNRG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-XQCC-N52

JESD-609 Code:

e3

Length:

8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

.71 ns

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

NB100LVEP221MNRG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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