Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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N04L1618C2AB2-85I by Onsemi is a 256Kx16 SRAM with 85ns access time, operating at 1.8V. It features a low profile grid array package suitable for industrial applications requiring fast and reliable memory storage. With 3-state output characteristics and common I/O type, it offers efficient parallel data processing in various electronic devices.
Median Price
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2
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1k+
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Corohmni
Provides durability and protection for the internal components, making the product long-lasting.
Allows for easy installation on circuit boards, saving time and effort during assembly.
Enables independent access to each memory location, increasing speed and efficiency.
Efficient power usage and compatibility with various systems.
Sufficient terminals for connections, ensuring reliability and stability.
Can withstand high temperatures, suitable for industrial environments.
Optimal organization for memory access and storage capacity.
Allows for multiple output states, enhancing flexibility in data transmission.
Operational in low-temperature conditions, suitable for a wide range of environments.
Low profile design, ideal for space-constrained applications.
SRAM N04L1618C2AB2-85I attributes and parameters. Explore more SRAM devices from Onsemi
Maximum Access Time:
Input/Output Type:
JESD-30 Code:
JESD-609 Code:
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Memory Width:
No. of Functions:
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No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Package Body Material:
Package Code:
Package Equivalence Code:
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Package Style (Meter):
Parallel or Serial:
Power Supplies (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Minimum Standby Voltage:
Sub-Category:
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Width:
N04L1618C2AB2-85I Memory ICs trade compliance attributes, and parameters.
ECCN
3A991.B.2.A
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N2222A
Micro Commercial Components
Small Signal Bipolar Transistors; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-609 Code: e0;
BAV99
Lite-on Technology
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us;
2N7002
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
1N4148WS
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
MURS160T3G
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
LL4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
MBRM140T1G
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
1N4148
Crimson Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
CSNF651
Honeywell Sensing And Control
CSNF651 by Honeywell Sensing And Control is an industrial-grade analog circuit with 3 terminals. It operates b/w -40 to 85°C, supporting supply voltages from -15V to 15V. Ideal for applications requiring a special shape rectangular package style and through-hole terminal form.
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Nexperia
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
Bkc Semiconductors
IS62C256AL-45ULI
Integrated Silicon Solution
IS62C256AL-45ULI by Integrated Silicon Solution is a 32Kx8 SRAM with 45ns access time, operating at 5V. It features asynchronous mode, 3-STATE output, and industrial temperature grade. Ideal for applications requiring fast and reliable memory storage in harsh environments.
5962-8685904LA
Pyramid Semiconductor
OTHER SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Width: 7.62 mm;
71V124SA12TYG8
Renesas Electronics
The Renesas Electronics 71V124SA12TYG8 is a 128Kx8 SRAM with a supply voltage of 3.3V, operating in asynchronous mode. It features a small outline package, 70°C max temp, and offers fast access time of 12ns. Ideal for applications requiring high-speed memory operations in commercial-grade environments.
IS62WV51216BLL-55TLI
IS62WV51216BLL-55TLI by Integrated Silicon Solution is a 512Kx16 SRAM with 55ns access time, operating at 3.3V. It features asynchronous mode, 44 terminals in small outline package, and industrial temperature grade. Ideal for applications requiring fast and reliable memory storage in harsh environments.
AS6C4008-55TIN
Alliance Memory
Alliance Memory's AS6C4008-55TIN is a 512Kx8 SRAM with 55ns access time, operating at 3V. Ideal for industrial applications, it features a small outline package and common I/O type. With 524288 words and parallel interface, it offers reliable memory storage in compact systems.
CY62147EV30LL-45ZSXIT
Infineon Technologies
CY62147EV30LL-45ZSXIT by Infineon Technologies is a 256Kx16 SRAM with 3.3V nominal voltage, operating in asynchronous mode. It features a small outline, thin profile package and offers fast access time of 45ns. Ideal for industrial applications requiring high-speed memory with low standby current consumption.
R1RW0416DSB-2LR#D1
Renesas Electronics' R1RW0416DSB-2LR#D1 is a 256Kx16 SRAM with 12ns access time, operating at 3.3V. It features a small outline package, suitable for commercial applications requiring fast and reliable parallel memory operations. The device has a memory density of 4Mb and operates in an asynchronous mode within a temperature range of 0 to 70°C.
AS7C38096A-10TIN
Alliance Memory's AS7C38096A-10TIN is a 1MX8 SRAM with 10ns access time, operating at 3.3V. Ideal for industrial applications, it offers a memory density of 8388608 bits and operates in parallel mode with a package size of 18.415mm x 10.16mm x 1.2mm.
CY14B116L-ZS25XIT
Infineon's CY14B116L-ZS25XIT is a 2MX8 SRAM with 16777216-bit memory density, operating at 3V. It features an access time of 25ns and is ideal for industrial applications requiring non-volatile memory storage in a small outline package.
HM628512BLFP-7
Renesas Electronics' HM628512BLFP-7 is a 512Kx8 SRAM with 70ns access time, operating at 5V. It features a small outline package, common I/O type, and 3-state output characteristics. Ideal for applications requiring fast and reliable memory storage in electronic devices.
IDT71016S15PHGI8
The Renesas Electronics IDT71016S15PHGI8 is a 64Kx16 SRAM with 3-STATE output, operating at 5V. It features a small outline package, industrial temperature grade, and GULL WING terminals. Ideal for applications requiring fast access times and high memory density in industrial environments.
5962-9461110HMA
Defense Logistics Agency
Defense Logistics Agency's 5962-9461110HMA is a ceramic, metal-sealed co-fired SRAM module with 512Kx32 organization. Operating at 5V, it has an asynchronous mode and parallel technology. Ideal for military applications with a temperature range of -55 to 125°C and max access time of 17ns.
71V424S10PHGI
Renesas Electronics' 71V424S10PHGI is a 512Kx8 SRAM with 3.3V supply, operating in asynchronous mode. It features a small outline package, industrial temperature grade, and Gull Wing terminals. Ideal for applications requiring fast access times and high memory density like industrial control systems.
CY62167DV30LL-55ZXI
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; JESD-609 Code: e3;
71024S15YG
Integrated Device Technology
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: SOJ; Package Shape: RECTANGULAR; No. of Words Code: 128K;
IDT7007L20JGI8
The Renesas Electronics IDT7007L20JGI8 is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features a max access time of 20ns and memory density of 262144 bits. Ideal for industrial applications requiring fast parallel memory access in a grid array package style.
CY7C1021DV33-10ZSXI
Infineon's CY7C1021DV33-10ZSXI is a 64Kx16 SRAM with 100MHz clock frequency, 10ns access time, and 3.3V nominal voltage. Ideal for applications requiring fast and reliable memory storage in small outline packages.
AS7C256A-10TIN
Alliance Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: TSOP1; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G28;
AS6C1008-55PCN
Alliance Memory's AS6C1008-55PCN is a 128Kx8 SRAM with 55ns access time, operating at 3V. It features asynchronous mode, 3-state output, and common I/O type. Ideal for applications requiring fast read/write operations in commercial temperature environments.
5962-8685924YA
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 22; Package Code: DIP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
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N04L163WC2AB2-85I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
N04L163WC1AB-70I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
N04L1630C2BB2-55I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
N04L163WC2AB2-55I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: RECTANGULAR; No. of Words: 262144 words;
N04L163WC1AT2-70I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: LSSOP; Package Shape: RECTANGULAR; No. of Functions: 1;
N04L163WC1AB2-70I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: RECTANGULAR; Organization: 256KX16;
N04L163WC2AB-55I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;
N04L163WC1AB-85I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: RECTANGULAR; Width: 6 mm;
N04L1630C2BB2-70I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: RECTANGULAR; Length: 8 mm;
N04L163WC1AT-85I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: LSSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.3 V;
N04L163WC1AT2-85I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: LSSOP; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;
N04L1630C2BT2-70I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: LSSOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G44;
N04L163WC2AB2-70I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: RECTANGULAR; Power Supplies (V): 3/3.3;
N04L1618C2AB-85I
N04L163WC1AB2-85I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B48;
N04L1618C2AB2-70I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.34 mm;
N04L1618C2AB-70I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
N04L1630C2BT2-55I
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: LSSOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.25 mm;
N04L163WC1AT-70I
Nanoamp Solutions
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Memory Width: 16;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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