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CY7C1061G30-10ZXI

Cypress Semiconductor

CY7C1061G30-10ZXI by Cypress Semiconductor

STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

Median Price

$27.500

Lifecycle Status

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10

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Chip1Stop

Japan . 26 parts In-Stock

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$47.600

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Mouser Electronics

USA . 14 parts In-Stock

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$48.090

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$29.340

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$28.580

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$28.580

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DigiKey

USA . 50,143 parts In-Stock

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$15.270

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Verical

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$17.640

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Rochester

USA . 6 parts In-Stock

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$27.500

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$24.610

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$23.160

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Digiode

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Nova Conductors

Japan . 300 parts In-Stock

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$35.766

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Flip Electronics

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Vyrian

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Ampacity Inc.

Singapore . 16,703 parts In-Stock

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$12.980

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Corphita

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$27.504

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Modulus Dynamics

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$32.698

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$31.335

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Netroflash

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Continental Prestige Electronics

USA . 173 parts In-Stock

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$35.051

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Argo Parts USA

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Perfect Parts

USA . 215 parts In-Stock

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Technical Specifications

SRAM CY7C1061G30-10ZXI attributes and parameters. Explore more SRAM devices from Cypress Semiconductor

Specs

Maximum Access Time:

10 ns

JESD-30 Code:

R-PDSO-G48

Length:

18.4 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

12 mm

Trade Compliance

CY7C1061G30-10ZXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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