Loading...

N04L163WC1AT2-70I

Onsemi

N04L163WC1AT2-70I by Onsemi

N04L163WC1AT2-70I by Onsemi is a 256Kx16 SRAM with 3.6V max supply voltage, operating at -40 to 85 °C. It features a 70ns access time, 0.8mm terminal pitch, and industrial temperature grade. Ideal for applications requiring fast and reliable memory storage in compact electronic devices.

Median Price

$3.785

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 103 parts In-Stock

1+ parts

$3.710

100+ parts

$3.490

1k+ parts

$3.150

10k+ parts

-

103

$3.710

$3.490

$3.150

-

DigiKey

USA . 103 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.860

10k+ parts

$3.860

103

-

-

$3.860

$3.860

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,069 parts In-Stock

1+ parts

$3.524

100+ parts

-

1k+ parts

-

10k+ parts

-

1,069

$3.524

-

-

-

Bristol Electronics

USA . 20 parts In-Stock

1+ parts

$15.000

100+ parts

$9.375

1k+ parts

-

10k+ parts

-

20

$15.000

$9.375

-

-

Vyrian

USA . 7,715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,715

-

-

-

-

DigiKey Marketplace

USA . 103 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

103

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,653 parts In-Stock

1+ parts

$3.339

100+ parts

-

1k+ parts

-

10k+ parts

-

1,653

$3.339

-

-

-

Corohmni

South Africa . 474 parts In-Stock

1+ parts

$3.710

100+ parts

-

1k+ parts

-

10k+ parts

-

474

$3.710

-

-

-

Problanco Electronics

Mexico . 7,731 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,731

-

-

-

-

Kepictronics

USA . 3,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,200

-

-

-

-

Metaverse IC Inc.

Canada . 2,685 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,685

-

-

-

-

SupplyDigital Components

Austria . 1,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,635

-

-

-

-

UHIMA Technologies

Türkiye . 741 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

741

-

-

-

-

Kulean Microsystems

USA . 195 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

195

-

-

-

-

TANS Electronics

Latvia . 125 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

125

-

-

-

-

Overview

Discover the cutting-edge N04L163WC1AT2-70I by Onsemi, a top-tier manufacturer known for producing high-quality SRAM products. This innovative memory IC offers unparalleled performance and reliability, making it ideal for a wide range of applications. With a compact design and advanced technology, this product provides customers with superior value and benefits. Experience seamless operation and enhanced efficiency with the N04L163WC1AT2-70I, setting a new standard in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent data transfers, providing flexibility in handling multiple tasks simultaneously.

Nominal Supply Voltage / Vsup (V): 3

A nominal supply voltage of 3V ensures compatibility with a wide range of electronic systems and power sources.

No. of Terminals: 44

Having 44 terminals allows for efficient connectivity and signal routing in complex circuit designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliability and performance in harsh industrial environments.

Memory IC Type: STANDARD SRAM

Utilizing standard SRAM technology ensures fast data access and low power consumption, making it suitable for a variety of applications.

Technical Specifications

SRAM N04L163WC1AT2-70I attributes and parameters. Explore more SRAM devices from Onsemi

Specs

Maximum Access Time:

70 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

Length:

18.41 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.25 mm

Maximum Standby Current:

.00001 Amp

Minimum Standby Voltage:

1.8 V

Sub-Category:

SRAMs

Maximum Supply Current:

16 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10.16 mm

Trade Compliance

N04L163WC1AT2-70I Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20