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CY62177EV30LL-55BAXIT

Infineon Technologies

CY62177EV30LL-55BAXIT by Infineon Technologies

Infineon's CY62177EV30LL-55BAXIT is a 2MX16 SRAM with 3-STATE output, operating at 2.5/3.3V. It features a grid array package, fine pitch style, and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring fast access times and high memory density.

Median Price

$36.315

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 23,900 parts In-Stock

1+ parts

-

100+ parts

$40.350

1k+ parts

$36.100

10k+ parts

$33.975

23,900

-

$40.350

$36.100

$33.975

Rochester

USA . 23,900 parts In-Stock

1+ parts

-

100+ parts

$32.280

1k+ parts

$28.880

10k+ parts

$27.180

23,900

-

$32.280

$28.880

$27.180

Flip Electronics (Authorized)

USA . 11,234 parts In-Stock

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11,234

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Flip Electronics

USA . 10,500 parts In-Stock

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10,500

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Vyrian

USA . 7,194 parts In-Stock

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Chip Stock

USA . 3,650 parts In-Stock

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Digiode

USA . 861 parts In-Stock

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861

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 3,811 parts In-Stock

1+ parts

$2.287

100+ parts

$2.196

1k+ parts

$2.104

10k+ parts

-

3,811

$2.287

$2.196

$2.104

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Aztec Data Supply Inc.

USA . 2,391 parts In-Stock

1+ parts

$4.897

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$4.897

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Corohmni

South Africa . 192 parts In-Stock

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$5.130

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192

$5.130

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Semicontronic

India . 11,139 parts In-Stock

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$14.000

100+ parts

$13.650

1k+ parts

$13.580

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11,139

$14.000

$13.650

$13.580

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Ampacity Inc.

Singapore . 7,507 parts In-Stock

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$24.310

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$24.310

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Component Stockers USA

USA . 251 parts In-Stock

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$396.560

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251

$396.560

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Continental Prestige Electronics

USA . 4,352 parts In-Stock

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Argo Parts USA

USA . 613 parts In-Stock

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Corphita

USA . 138 parts In-Stock

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138

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Advanced Electronics

New Zealand . 87 parts In-Stock

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Overview

Unlock the power of reliable data storage with the CY62177EV30LL-55BAXIT from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality SRAM products that are perfect for a wide range of applications. Whether you're looking to boost the performance of your industrial equipment or increase the efficiency of your networking devices, this SRAM memory module offers unmatched value, benefits, and advantages. Trust in Infineon's expertise and choose the CY62177EV30LL-55BAXIT for all your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly processes.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode provides flexibility and simplifies interfacing with other components.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages increases compatibility with various systems.

No. of Terminals: 48

Having 48 terminals allows for a higher level of connectivity and integration within the system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.

Memory Density: 33554432 bit

High memory density enables the storage of a large amount of data in a compact form factor.

Maximum Access Time: 55 ns

The fast maximum access time ensures quick data retrieval and processing, enhancing overall performance.

Technical Specifications

SRAM CY62177EV30LL-55BAXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

55 ns

Alternate Memory Width:

8

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Standby Current:

.000017 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

45 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Trade Compliance

CY62177EV30LL-55BAXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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