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MUN2113T1

Onsemi

MUN2113T1 by Onsemi

MUN2113T1 by Onsemi is a PNP BJT transistor with built-in resistor for switching applications. It has a max collector-emitter voltage of 50V, max collector current of 0.1A, and min DC current gain of 80. This small outline package with gull wing terminals is ideal for surface mount designs.

Median Price

$0.035

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 108,500 parts In-Stock

1+ parts

-

100+ parts

$0.030

1k+ parts

$0.025

10k+ parts

$0.023

108,500

-

$0.030

$0.025

$0.023

DigiKey

USA . 108,500 parts In-Stock

1+ parts

-

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$0.040

108,500

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$0.040

Verical

USA . 96,000 parts In-Stock

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96,000

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Distributors (In-Stock)

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Digiode

USA . 275 parts In-Stock

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$0.024

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275

$0.024

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Vyrian

USA . 2,022 parts In-Stock

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$0.025

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2,022

$0.025

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Chip Stock

USA . 62,000 parts In-Stock

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62,000

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Ack Elektronik San.Tic.Ltd.Sti

. 4,500 parts In-Stock

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4,500

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LIBRA Elektronik GmbH

Germany . 3,000 parts In-Stock

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3,000

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Bristol Electronics

USA . 2,045 parts In-Stock

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-

100+ parts

$0.068

1k+ parts

$0.011

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-

2,045

-

$0.068

$0.011

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R&J Components

USA . 1,452 parts In-Stock

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1,452

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Distributors (Availability)

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Corphita

USA . 1,729 parts In-Stock

1+ parts

$0.022

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1,729

$0.022

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Corohmni

South Africa . 375 parts In-Stock

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$0.025

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375

$0.025

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Component Stockers USA

USA . 121,053 parts In-Stock

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$0.030

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$0.020

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$0.020

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$0.020

121,053

$0.030

$0.020

$0.020

$0.020

Continental Prestige Electronics

USA . 108,500 parts In-Stock

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$0.021

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$0.021

Problanco Electronics

Mexico . 6,664 parts In-Stock

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6,664

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Metaverse IC Inc.

Canada . 6,000 parts In-Stock

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6,000

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SupplyDigital Components

Austria . 5,224 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,147 parts In-Stock

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5,147

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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J Silver Components DBA - Lantern Electronics

USA . 3,000 parts In-Stock

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Assy Fe

Spain . 2,400 parts In-Stock

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2,400

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RC Electronics

USA . 2,000 parts In-Stock

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$0.040

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$0.040

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$0.040

2,000

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$0.040

$0.040

$0.040

TANS Electronics

Latvia . 1,791 parts In-Stock

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1,791

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UHIMA Technologies

Türkiye . 315 parts In-Stock

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315

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Kulean Microsystems

USA . 283 parts In-Stock

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283

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Overview

Enhance your electronic designs with the MUN2113T1 by Onsemi, a top-quality Small Signal Bipolar Junction Transistor with PNP polarity and a built-in resistor. Perfect for switching applications, this transistor offers reliable performance and efficient power dissipation in a compact, surface mount package. With a high DC current gain of 80 and a maximum collector-emitter voltage of 50V, this transistor delivers the value and benefits you need for your projects. Trust Onsemi's reputation for excellence and elevate your circuits with the MUN2113T1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the transistor, making it suitable for various environments and applications.

Polarity or Channel Type: PNP

PNP transistors are commonly used in high-side switching applications, making this transistor versatile for different circuit designs.

Configuration: SINGLE WITH BUILT-IN RESISTOR

The built-in resistor simplifies circuit design and saves space on the PCB, making this transistor a convenient choice for compact electronic devices.

Transistor Application: SWITCHING

Designed for switching applications, this transistor can efficiently control the flow of current in electronic circuits, making it ideal for power management and control.

Surface Mount: YES

Being surface mountable allows for easier and faster assembly of electronic devices, improving productivity and reducing manufacturing costs.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized form factor for easy integration into various circuit layouts and designs.

Maximum Power Dissipation (Abs): 0.2 W

With a maximum power dissipation of 0.2W, this transistor can handle moderate power levels without overheating, ensuring reliable performance.

Minimum DC Current Gain (hFE): 80

A high minimum DC current gain of 80 indicates good amplification capabilities, making this transistor suitable for signal amplification applications.

Maximum Collector-Emitter Voltage: 50 V

The high maximum collector-emitter voltage rating of 50V allows this transistor to control higher voltage loads, increasing its versatility in various circuit designs.

Maximum Collector Current (IC): 0.1 A

With a maximum collector current of 0.1A, this transistor can handle small to moderate current levels, making it suitable for low-power applications.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and conductivity, ensuring reliable connections during assembly and operation.

Peak Reflow Temperature °C: 235

The high peak reflow temperature of 235 °C allows for reliable soldering during assembly, ensuring strong and durable connections between the transistor and the PCB.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MUN2113T1 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

BUILT-IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

80

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MUN2113T1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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