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MT9F002D00C2EB-N3003-200

Onsemi

MT9F002D00C2EB-N3003-200 by Onsemi

The Onsemi MT9F002D00C2EB-N3003-200 image sensor features 1.40x1.40 um pixel size, 64 MHz master clock, and 4640 horizontal pixels. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high resolution and digital voltage output interface.

Median Price

$67.332

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 27,502 parts In-Stock

1+ parts

-

100+ parts

$59.850

1k+ parts

$53.550

10k+ parts

$50.400

27,502

-

$59.850

$53.550

$50.400

Verical

USA . 27,502 parts In-Stock

1+ parts

-

100+ parts

$74.813

1k+ parts

$66.938

10k+ parts

$63.000

27,502

-

$74.813

$66.938

$63.000

DigiKey

USA . 8,927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,927

-

-

-

-

Distributors (In-Stock)

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Digiode

USA . 575 parts In-Stock

1+ parts

$63.327

100+ parts

-

1k+ parts

-

10k+ parts

-

575

$63.327

-

-

-

Vyrian

USA . 1,843 parts In-Stock

1+ parts

$66.660

100+ parts

-

1k+ parts

-

10k+ parts

-

1,843

$66.660

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,350 parts In-Stock

1+ parts

$59.994

100+ parts

-

1k+ parts

-

10k+ parts

-

2,350

$59.994

-

-

-

Corohmni

South Africa . 466 parts In-Stock

1+ parts

$66.660

100+ parts

-

1k+ parts

-

10k+ parts

-

466

$66.660

-

-

-

SupplyDigital Components

Austria . 8,222 parts In-Stock

1+ parts

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8,222

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TANS Electronics

Latvia . 7,787 parts In-Stock

1+ parts

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7,787

-

-

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Kulean Microsystems

USA . 5,103 parts In-Stock

1+ parts

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5,103

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Problanco Electronics

Mexico . 3,038 parts In-Stock

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3,038

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UHIMA Technologies

Türkiye . 935 parts In-Stock

1+ parts

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935

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Overview

Capture every detail with the MT9F002D00C2EB-N3003-200 image sensor by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This sensor is perfect for a wide range of applications, offering stunning image quality and high performance. Whether you're a professional photographer, security system integrator, or industrial manufacturer, this sensor provides value, benefits, and advantages that will exceed your expectations. Upgrade your imaging experience with the MT9F002D00C2EB-N3003-200 today.

Feature Benefit Bullets

Pixel Size (um): 1.40X1.40

This small pixel size allows for high resolution images to be captured with great detail.

Maximum Supply Voltage: 1.9 V

Allows for a higher voltage input which can result in improved performance and signal-to-noise ratio.

Master Clock: 64 MHz

High master clock frequency enables fast data readout and processing, essential for capturing moving objects or video.

Body Width: 10 inch

Large body width ensures stability and durability of the sensor.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS technology offers low noise and high sensitivity, making it an ideal choice for image sensors.

Package Shape or Style: SQUARE

Square package shape allows for easy integration into various applications and circuit layouts.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures the sensor can perform reliably in various environments.

Horizontal Pixel: 4640

High horizontal pixel count results in detailed and high-resolution images.

Output Range: 0.40-1.40V

Wide output range provides flexibility in signal processing and adjustment.

Output Type: DIGITAL VOLTAGE

Digital output voltage simplifies signal processing and integration with digital systems.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows the sensor to be used in cold environments without performance degradation.

Maximum Operating Current: 75 mA

Low operating current helps in reducing power consumption and heat generation.

Housing: PLASTIC

Lightweight and durable plastic housing makes the sensor suitable for portable and rugged applications.

Dynamic Range: 65.3 dB

Wide dynamic range allows the sensor to capture both bright and dark areas in the image with detail.

Vertical Pixel: 3320

High vertical pixel count contributes to the overall image resolution and quality.

Body Length/Diameter: 10 mm

Compact body size makes the sensor easy to mount and integrate into various devices.

Optical Format (inch): 1/2.3

Standard optical format allows for interchangeability with other lenses and optical components.

Termination Type: SOLDER

Solder termination provides a reliable and secure connection for the sensor.

Output Interface Type: 2-WIRE INTERFACE

2-Wire interface simplifies the connection and communication with external devices and controllers.

Frame Rate: 13.7 fps

Decent frame rate enables smooth video recording and fast capture of moving objects.

Array Type: FRAME

Frame array type ensures the sensor can capture full images in one go, reducing processing time and complexity.

Mounting Feature: SURFACE MOUNT

Surface mount capability allows for easy and secure mounting on circuit boards or devices.

Technical Specifications

Image Sensors MT9F002D00C2EB-N3003-200 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO HAVE ANALOG SUPPLY VOLTAGE 2.70-3.10 V, ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Body Width:

10 inch

Body Height:

1.25 mm

Body Length/Diameter:

10 mm

Dynamic Range:

65.3 dB

Frame Rate:

13.7 fps

Horizontal Pixel:

4640

Housing:

PLASTIC

Master Clock:

64 MHz

Mounting Feature:

Maximum Operating Current:

75 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/2.3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

1.40X1.40

Sensors or Transducers Type:

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Termination Type:

SOLDER

Vertical Pixel:

3320

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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