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MMBTH10M3T5G

Onsemi

MMBTH10M3T5G by Onsemi

MMBTH10M3T5G by Onsemi is a NPN RF BJT with 650 MHz fT, 60 min hFE, and 0.64 W Pd. It is used in RF applications due to its small outline package and high transition frequency. The transistor operates up to 150 °C and has matte tin terminal finish for surface mount assembly.

Median Price

$0.043

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 16,000 parts In-Stock

1+ parts

$0.032

100+ parts

-

1k+ parts

-

10k+ parts

$0.007

16,000

$0.032

-

-

$0.007

Mouser Electronics

USA . 4,975 parts In-Stock

1+ parts

$0.110

100+ parts

$0.047

1k+ parts

-

10k+ parts

$0.044

4,975

$0.110

$0.047

-

$0.044

Rochester

USA . 111,148 parts In-Stock

1+ parts

-

100+ parts

$0.043

1k+ parts

$0.036

10k+ parts

$0.032

111,148

-

$0.043

$0.036

$0.032

Verical

USA . 14,637 parts In-Stock

1+ parts

-

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$0.040

14,637

-

-

-

$0.040

DigiKey

USA . 5,321 parts In-Stock

1+ parts

-

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5,321

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-

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Chip1Stop

Japan . 4,565 parts In-Stock

1+ parts

-

100+ parts

$0.073

1k+ parts

$0.060

10k+ parts

$0.028

4,565

-

$0.073

$0.060

$0.028

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,665 parts In-Stock

1+ parts

$0.033

100+ parts

-

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1,665

$0.033

-

-

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Vyrian

USA . 1,662 parts In-Stock

1+ parts

$0.035

100+ parts

-

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1,662

$0.035

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-

Flip Electronics

USA . 104,000 parts In-Stock

1+ parts

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104,000

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Chip Stock

USA . 35,000 parts In-Stock

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35,000

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Distributors (Availability)

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Corphita

USA . 1,053 parts In-Stock

1+ parts

$0.032

100+ parts

-

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1,053

$0.032

-

-

-

Corohmni

South Africa . 105 parts In-Stock

1+ parts

$0.035

100+ parts

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105

$0.035

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Perfect Parts

USA . 69,067 parts In-Stock

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69,067

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QUARKTWIN TECHNOLOGY LTD

USA . 18,171 parts In-Stock

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18,171

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iodParts Technologies Inc.

India . 8,000 parts In-Stock

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8,000

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Kulean Microsystems

USA . 6,045 parts In-Stock

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6,045

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Problanco Electronics

Mexico . 5,156 parts In-Stock

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5,156

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Authorized Procurement Solutions

USA . 4,555 parts In-Stock

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4,555

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SupplyDigital Components

Austria . 4,040 parts In-Stock

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4,040

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Metaverse IC Inc.

Canada . 2,860 parts In-Stock

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2,860

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TANS Electronics

Latvia . 2,171 parts In-Stock

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2,171

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UHIMA Technologies

Türkiye . 425 parts In-Stock

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425

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Overview

Boost your RF signal performance with the MMBTH10M3T5G by Onsemi. Crafted with precision and expertise, this NPN Small Signal Bipolar Junction Transistor offers outstanding quality and reliability for a wide range of applications. With a compact rectangular package design and a maximum transition frequency of 650 MHz, this transistor is perfect for high-frequency amplification needs. Experience seamless surface mount installation and enjoy the benefits of improved signal transmission efficiency. Elevate your projects with the superior value and performance of the MMBTH10M3T5G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the transistor, ensuring reliable performance over a long period of time.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplifying electronic signals, making this transistor suitable for a wide range of applications.

Configuration: SINGLE

Simplifies circuit design and integration, making it easier to incorporate this transistor into various electronic devices.

Surface Mount: YES

Enables easy and efficient soldering onto a PCB, saving time and effort during assembly.

Package Shape: RECTANGULAR

Facilitates compact placement on a PCB, allowing for densely populated circuits and saving valuable board space.

Terminal Form: FLAT

Ensures a secure connection during soldering, reducing the risk of electrical failures or intermittent connections.

No. of Terminals: 3

Simplifies the connection process and reduces the chances of wiring errors, improving overall reliability.

Maximum Power Dissipation (Abs): 0.64 W

With a high power dissipation, this transistor can handle a significant amount of power without overheating or malfunctioning.

Package Style (Meter): SMALL OUTLINE

Ideal for compact and space-constrained applications where size and weight are critical factors.

Minimum DC Current Gain (hFE): 60

Provides sufficient amplification for low current signals, making this transistor suitable for a wide range of signal processing applications.

Maximum Operating Temperature: 150 °C

Can operate reliably at high temperatures, making it suitable for applications where heat dissipation is a concern.

Terminal Finish: MATTE TIN

Offers good solderability and corrosion resistance, ensuring a reliable electrical connection over time.

Terminal Position: DUAL

Allows for easy and secure mounting on a PCB, ensuring proper alignment and reducing the risk of misplacement.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient amount of time, ensuring proper soldering without damaging the transistor.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures without degrading or losing functionality, ensuring reliable solder joints.

Nominal Transition Frequency (fT): 650 MHz

Offers high frequency performance for signal processing applications, making it suitable for RF and high-speed circuit designs.

Technical Specifications

RF Small Signal Bipolar Junction Transistors (BJT) MMBTH10M3T5G attributes and parameters. Explore more RF Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Configuration:

Minimum DC Current Gain (hFE):

60

JESD-30 Code:

R-PDSO-F3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Nominal Transition Frequency (fT):

Trade Compliance

MMBTH10M3T5G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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