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MGB15N35CLT4

Onsemi

MGB15N35CLT4 by Onsemi

MGB15N35CLT4 by Onsemi is an N-CHANNEL IGBT with built-in diode and resistor, ideal for automotive ignition applications. It has a max collector-emitter voltage of 380V, collector current of 15A, and power dissipation of 136W. This surface-mount transistor operates at up to 175 °C with turn-off time of 20500ns.

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Digiode

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Austria . 7,930 parts In-Stock

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TANS Electronics

Latvia . 7,272 parts In-Stock

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Kulean Microsystems

USA . 5,856 parts In-Stock

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Problanco Electronics

Mexico . 2,538 parts In-Stock

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Corphita

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UHIMA Technologies

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Overview

Elevate your automotive ignition systems with the MGB15N35CLT4 IGBT by Onsemi. Designed with precision and quality in mind, this N-CHANNEL transistor offers unparalleled performance and reliability. With a built-in diode and resistor, this single configuration device is perfect for a wide range of applications in the automotive industry. Trust in Onsemi's expertise and innovation to deliver top-notch products that exceed expectations. Upgrade your systems today and experience the value and benefits that the MGB15N35CLT4 has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good insulation properties and can handle high operating temperatures, making it suitable for automotive applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs have faster switching speeds and lower conduction losses, making them ideal for high-power applications such as automotive ignition.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Built-in diode and resistor help simplify circuit design and save space, making this IGBT a convenient choice for automotive ignition systems.

Transistor Application: AUTOMOTIVE IGNITION

Specifically designed for automotive ignition applications, ensuring reliable performance in high-voltage environments.

Maximum Power Dissipation (Abs): 136 W

High power dissipation capability allows the IGBT to handle high current loads without overheating, enhancing its reliability in automotive ignition systems.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this IGBT can withstand the heat generated during automotive ignition processes.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) MGB15N35CLT4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

VOLTAGE CLAMPING

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

380 V

Maximum Gate-Emitter Threshold Voltage:

2.1 V

Maximum Gate-Emitter Voltage:

22 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

20500 ns

Nominal Turn On Time (ton):

6000 ns

Trade Compliance

MGB15N35CLT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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