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MGB15N38CLT4

Onsemi

MGB15N38CLT4 by Onsemi

MGB15N38CLT4 by Onsemi is an N-CHANNEL IGBT with a max collector current of 15A and operating temperature of 175 °C. It is designed for automotive ignition applications, featuring a built-in diode and surface mount capability in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,312 parts In-Stock

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Vyrian

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Problanco Electronics

Mexico . 6,110 parts In-Stock

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TANS Electronics

Latvia . 5,685 parts In-Stock

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SupplyDigital Components

Austria . 3,073 parts In-Stock

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Kulean Microsystems

USA . 702 parts In-Stock

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UHIMA Technologies

Türkiye . 398 parts In-Stock

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Corohmni

South Africa . 333 parts In-Stock

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Corphita

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Overview

Unleash the power of innovation with the MGB15N38CLT4 by Onsemi! This insulated gate bipolar transistor is a game-changer in automotive ignition applications, offering unparalleled performance and reliability. With Onsemi's reputation for top-notch quality and cutting-edge technology, you can trust that this N-channel transistor will exceed your expectations. Say goodbye to worries about overheating or power limitations, as this transistor boasts a maximum power dissipation of 136W and a maximum collector-emitter voltage of 350V. Elevate your projects with the MGB15N38CLT4 and experience the difference that quality and precision engineering can make!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties for safe operation.

Polarity or Channel Type: N-CHANNEL

Offers efficient power handling capabilities and lower on-state resistance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves additional component cost.

Transistor Application: AUTOMOTIVE IGNITION

Suitable for demanding automotive ignition systems.

Surface Mount: YES

Easily mountable on PCBs for compact designs and ease of assembly.

Package Shape: RECTANGULAR

Provides a standard form factor for easy integration into various applications.

Terminal Form: GULL WING

Facilitates easier soldering and mechanical stability.

No. of Terminals: 2

Simplified connection with only 2 terminals.

Maximum Power Dissipation (Abs): 136 W

Ability to handle high power levels for robust performance.

Package Style (Meter): SMALL OUTLINE

Compact package design saves board space and enhances thermal performance.

Maximum Operating Temperature: 175 °C

Can withstand high operating temperatures for reliable operation in challenging environments.

Maximum Collector-Emitter Voltage: 350 V

Supports high voltage applications with a wide voltage range.

Transistor Element Material: SILICON

High-quality material for reliable and efficient transistor operation.

Maximum Collector Current (IC): 15 A

Capable of handling high collector currents for power applications.

Maximum Gate-Emitter Threshold Voltage: 2.1 V

Low threshold voltage ensures efficient switching performance.

Terminal Finish: Tin/Lead (Sn/Pb)

Provides good solderability and electrical conductivity.

Terminal Position: SINGLE

Simple terminal configuration for easy connection.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) MGB15N38CLT4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

350 V

Maximum Gate-Emitter Threshold Voltage:

2.1 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Trade Compliance

MGB15N38CLT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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