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MC10H210PG

Onsemi

MC10H210PG by Onsemi

MC10H210PG by Onsemi is a Logic Gates IC with 2 functions, 3 inputs, and 1.7 ns propagation delay at -5.2V supply voltage. It is used in high-speed applications due to its ECL technology, operating b/w 0-75 °C temperature range with through-hole terminals.

Median Price

$4.174

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21,100 parts In-Stock

1+ parts

-

100+ parts

$3.710

1k+ parts

$3.320

10k+ parts

$3.130

21,100

-

$3.710

$3.320

$3.130

Verical

USA . 9,600 parts In-Stock

1+ parts

-

100+ parts

$4.638

1k+ parts

$4.150

10k+ parts

-

9,600

-

$4.638

$4.150

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,392 parts In-Stock

1+ parts

$3.933

100+ parts

-

1k+ parts

-

10k+ parts

-

2,392

$3.933

-

-

-

Vyrian

USA . 8,723 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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8,723

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,356 parts In-Stock

1+ parts

$3.726

100+ parts

-

1k+ parts

-

10k+ parts

-

2,356

$3.726

-

-

-

Corohmni

South Africa . 475 parts In-Stock

1+ parts

$4.140

100+ parts

-

1k+ parts

-

10k+ parts

-

475

$4.140

-

-

-

AZTECH Wire

Italy . 136 parts In-Stock

1+ parts

$14.760

100+ parts

-

1k+ parts

-

10k+ parts

-

136

$14.760

-

-

-

Continental Prestige Electronics

USA . 21,100 parts In-Stock

1+ parts

-

100+ parts

$3.590

1k+ parts

-

10k+ parts

-

21,100

-

$3.590

-

-

SupplyDigital Components

Austria . 5,325 parts In-Stock

1+ parts

-

100+ parts

-

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5,325

-

-

-

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Kulean Microsystems

USA . 2,925 parts In-Stock

1+ parts

-

100+ parts

-

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2,925

-

-

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Problanco Electronics

Mexico . 2,409 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,409

-

-

-

-

TANS Electronics

Latvia . 1,486 parts In-Stock

1+ parts

-

100+ parts

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1,486

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-

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UHIMA Technologies

Türkiye . 822 parts In-Stock

1+ parts

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822

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Microchip USA

USA . 172 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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172

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Overview

Unlock the power of high-quality logic gates with the MC10H210PG by Onsemi. Designed with precision and reliability in mind, this product boasts a range of applications in various industries. With quick propagation delay and multiple functions, customers can expect seamless performance and efficiency. Say goodbye to technical hiccups and hello to smooth operations with the Onsemi MC10H210PG. Trust in a reputable manufacturer like Onsemi to deliver excellence in every product, providing you with the value and benefits you deserve. Elevate your projects with the MC10H210PG and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components of the logic gates, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 1.7 ns

The low propagation delay allows for fast signal processing, making this product suitable for high-speed applications where timing is critical.

No. of Functions: 2

Having multiple functions in a single package offers versatility and efficiency in circuit design, saving space and simplifying implementation.

No. of Inputs: 3

With three inputs, this logic gate can handle more complex input configurations, allowing for greater flexibility in designing logic circuits.

Nominal Supply Voltage / Vsup (V): -5.2

The specified supply voltage ensures consistent and reliable operation of the logic gates within the recommended voltage range.

Technical Specifications

Logic Gates MC10H210PG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Logic IC Type:

No. of Functions:

2

No. of Inputs:

3

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

1.7 ns

Propagation Delay (tpd):

1.55 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.44 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC10H210PG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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