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MC10H180FNG

Onsemi

MC10H180FNG by Onsemi

MC10H180FNG by Onsemi is a Digital Arithmetic Circuit with 2 functions, 2-bit resolution, and 20 terminals. It has a fast propagation delay of 2.5 ns and operates b/w 0-75 °C. Ideal for high-speed arithmetic operations in commercial applications.

Median Price

$21.288

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,888 parts In-Stock

1+ parts

-

100+ parts

$17.030

1k+ parts

$15.240

10k+ parts

$14.340

2,888

-

$17.030

$15.240

$14.340

DigiKey

USA . 2,888 parts In-Stock

1+ parts

-

100+ parts

$22.410

1k+ parts

-

10k+ parts

-

2,888

-

$22.410

-

-

Verical

USA . 2,888 parts In-Stock

1+ parts

-

100+ parts

$21.288

1k+ parts

$19.050

10k+ parts

$17.925

2,888

-

$21.288

$19.050

$17.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,039 parts In-Stock

1+ parts

$18.022

100+ parts

-

1k+ parts

-

10k+ parts

-

1,039

$18.022

-

-

-

Vyrian

USA . 11,993 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,993

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 202 parts In-Stock

1+ parts

$11.970

100+ parts

-

1k+ parts

-

10k+ parts

-

202

$11.970

-

-

-

Corohmni

South Africa . 226 parts In-Stock

1+ parts

$16.290

100+ parts

-

1k+ parts

-

10k+ parts

-

226

$16.290

-

-

-

Corphita

USA . 1,174 parts In-Stock

1+ parts

$17.073

100+ parts

-

1k+ parts

-

10k+ parts

-

1,174

$17.073

-

-

-

Component Stockers USA

USA . 2,845 parts In-Stock

1+ parts

$19.250

100+ parts

$18.090

1k+ parts

$16.360

10k+ parts

-

2,845

$19.250

$18.090

$16.360

-

Kulean Microsystems

USA . 7,454 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,454

-

-

-

-

Problanco Electronics

Mexico . 6,951 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,951

-

-

-

-

Continental Prestige Electronics

USA . 2,888 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,888

-

-

-

-

TANS Electronics

Latvia . 1,939 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,939

-

-

-

-

UHIMA Technologies

Türkiye . 629 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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629

-

-

-

-

Microchip USA

USA . 265 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

265

-

-

-

-

SupplyDigital Components

Austria . 46 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

46

-

-

-

-

Overview

Elevate your digital arithmetic circuits with the MC10H180FNG by Onsemi. This innovative product offers exceptional quality and reliability, thanks to the renowned manufacturer's commitment to excellence. Ideal for a wide range of applications, this chip carrier package boasts 2 functions and 2 bits without compromising on performance. With a fast propagation delay of 2.5 ns and a temperature range of 0 to 75 °C, customers can trust in the value, benefits, and advantages that this product brings to their projects. Experience the difference with Onsemi's MC10H180FNG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable casing for the circuits, ensuring long-term reliability.

Surface Mount: YES

Enables easy installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Offers dual functionality in a single package, increasing efficiency and reducing space requirements.

Package Shape: SQUARE

Square shape allows for easy placement and alignment on the circuit board.

No. of Bits: 2

Provides sufficient digital precision for many applications, balancing performance and complexity.

No. of Terminals: 20

Offers multiple connection points for versatile integration with other circuit components.

Propagation Delay (tpd): 2.5 ns

Low propagation delay ensures fast signal processing, critical for time-sensitive applications.

Maximum Operating Temperature: 75 °C

Wide operating temperature range allows for reliable performance in various environments.

Minimum Operating Temperature: 0 °C

Capable of functioning in cold conditions, enhancing the product's versatility.

Terminal Finish: TIN

Tin finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

Quad terminal position enables stable and secure mounting on the circuit board.

Maximum Seated Height: 4.57 mm

Compact size with a low profile allows for space-efficient installation in tight spaces.

Width: 8.965 mm

Narrow width facilitates close arrangement of multiple circuits, optimizing board layout.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure solder joints during assembly processes.

Length: 8.965 mm

Compact length contributes to the overall space-saving design of the product.

Temperature Grade: COMMERCIAL EXTENDED

Designed for reliable operation in extended commercial temperature ranges, suitable for various applications.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, ideal for demanding digital arithmetic tasks.

Terminal Form: J BEND

J-bend terminals provide secure mechanical support and electrical connectivity on the circuit board.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatibility with common PCB layouts and assembly processes.

Technical Specifications

Digital Arithmetic Circuits MC10H180FNG attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

2.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10H180FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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