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SN74HC688DWG4

Texas Instruments

SN74HC688DWG4 by Texas Instruments

SN74HC688DWG4 by Texas Instruments is an 8-bit digital arithmetic circuit with a supply voltage of 5V. It features a propagation delay of 265ns, operates in industrial temperature range (-40 to 85°C), and has inverted output polarity. This small outline package is ideal for applications requiring fast arithmetic operations in various electronic systems.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,182 parts In-Stock

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Digiode

USA . 2,419 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Andel Nordic

Denmark . 1,222 parts In-Stock

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$5.207

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$4.999

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$4.999

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$4.999

$4.999

AZTECH Wire

Italy . 645 parts In-Stock

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$7.246

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Corohmni

South Africa . 683 parts In-Stock

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Parana Technologies

USA . 2,316 parts In-Stock

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$27.578

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$37.522

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Ampacity Inc.

Singapore . 1,324 parts In-Stock

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$29.000

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One Stop Electronics

USA . 664 parts In-Stock

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DigiPath Technology Company

USA . 93 parts In-Stock

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$30.366

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$27.937

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ChromeModa Solutions

Germany . 5,356 parts In-Stock

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$30.986

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IDEA Electronic Components Group

UK . 247 parts In-Stock

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$29.437

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$27.887

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Semicontronic

India . 1,470 parts In-Stock

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Component Stockers USA

USA . 319 parts In-Stock

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Corphita

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Argo Parts USA

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Continental Prestige Electronics

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Advanced Electronics

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Bastille Electronics

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Perfect Parts

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Overview

Unleash the power of precision with the SN74HC688DWG4 by Texas Instruments, a top-of-the-line digital arithmetic circuit that delivers unparalleled quality and performance. Manufactured by the trusted name in electronics, this product is designed to meet the highest industry standards, making it ideal for a wide range of applications. With its advanced technology and reliable construction, customers can trust that they are getting a product that offers exceptional value, benefits, and advantages. Upgrade your systems with the SN74HC688DWG4 and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the circuit components, making it suitable for a variety of applications.

No. of Bits: 8

Offers sufficient computational capability for a range of arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage level that is commonly available, ensuring compatibility with existing systems.

Propagation Delay (tpd): 265 ns

Low propagation delay allows for quick processing of arithmetic operations, improving overall system performance.

Maximum Operating Temperature: 85 °C

High operating temperature range enables use in industrial environments without risk of damage.

Width: 7.5 mm

Compact size makes for easy integration into electronic circuit designs with limited space.

Technical Specifications

Digital Arithmetic Circuits SN74HC688DWG4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

265 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74HC688DWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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