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SN74HC680JP4

Texas Instruments

SN74HC680JP4 by Texas Instruments

SN74HC680JP4 by Texas Instruments is a CMOS digital arithmetic circuit with 20 terminals in an IN-LINE package. It operates b/w -40°C to 85°C, making it suitable for industrial applications requiring precise calculations and data processing. The ceramic package ensures durability and reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,138 parts In-Stock

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6,138

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Digiode

USA . 3,394 parts In-Stock

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3,394

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,484 parts In-Stock

1+ parts

$6.690

100+ parts

-

1k+ parts

$6.422

10k+ parts

$6.422

1,484

$6.690

-

$6.422

$6.422

Parana Technologies

USA . 471 parts In-Stock

1+ parts

$11.113

100+ parts

-

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$11.569

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471

$11.113

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$11.569

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DigiPath Technology Company

USA . 1,467 parts In-Stock

1+ parts

$12.237

100+ parts

$11.258

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1,467

$12.237

$11.258

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IDEA Electronic Components Group

UK . 939 parts In-Stock

1+ parts

$12.487

100+ parts

$11.863

1k+ parts

$11.238

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939

$12.487

$11.863

$11.238

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ChromeModa Solutions

Germany . 683 parts In-Stock

1+ parts

$12.487

100+ parts

$10.239

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683

$12.487

$10.239

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AZTECH Wire

Italy . 467 parts In-Stock

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$14.190

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467

$14.190

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One Stop Electronics

USA . 369 parts In-Stock

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$65.000

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369

$65.000

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Corphita

USA . 116 parts In-Stock

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116

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Overview

Unlock the power of advanced digital arithmetic circuits with the SN74HC680JP4 by Texas Instruments. Crafted with precision and expertise, this ceramic package houses cutting-edge technology that ensures reliable performance in industrial-grade environments. With 20 terminals and a dual terminal position, this versatile component is ideal for a wide range of applications. From data processing to signal manipulation, this product offers unparalleled value and efficiency, making it a must-have for any engineering project. Elevate your designs with the quality and innovation of Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity, making the product more reliable for high temperature applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easier integration into circuit designs and improves overall space efficiency.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting the circuit to other components or devices.

Package Style (Meter): IN-LINE

In-line package style allows for easier assembly and maintenance of the product.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature increases the versatility of the product for use in various temperature environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved reliability in connectivity.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can perform reliably in industrial settings with varying temperature ranges.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure soldering connections and better mechanical stability for the product.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm allows for easy integration and compatibility with other components or circuit boards.

Technical Specifications

Digital Arithmetic Circuits SN74HC680JP4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC680JP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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