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SN74HC148DR

Texas Instruments

SN74HC148DR by Texas Instruments

SN74HC148DR by Texas Instruments is an 8-bit digital arithmetic circuit with a propagation delay of 49ns at 5V. It operates within a temperature range of -40 to 85°C and has a max power supply current of 0.08mA. Ideal for industrial applications requiring inverted output polarity and CMOS technology.

Median Price

$0.248

Lifecycle Status

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DigiKey

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$0.650

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$0.363

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$0.285

8,212

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$0.285

Mouser Electronics

USA . 5,838 parts In-Stock

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$0.650

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$0.363

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$0.317

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$0.296

5,838

$0.650

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$0.317

$0.296

Arrow

USA . 7,500 parts In-Stock

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$0.096

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Chip1Stop

Japan . 1,268 parts In-Stock

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Verical

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Rochester

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50

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Maritex

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TME

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$0.650

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$0.360

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$0.321

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1,062

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Vyrian

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Chip Stock

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Bristol Electronics

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Touchstone Systems

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Sensible Micro Corp

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Semicontronic

India . 10,916 parts In-Stock

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$0.082

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$0.080

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Ampacity Inc.

Singapore . 10,778 parts In-Stock

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Corphita

USA . 2,260 parts In-Stock

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Component Stockers USA

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Argo Parts USA

USA . 4,417 parts In-Stock

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Continental Prestige Electronics

USA . 2,732 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Andel Nordic

Denmark . 2,364 parts In-Stock

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$9.646

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$9.260

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Corohmni

South Africa . 1,093 parts In-Stock

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Parana Technologies

USA . 1,772 parts In-Stock

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$1,453.648

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$14.088

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USA . 495 parts In-Stock

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Lixinc

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GreenTree Electronics

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Overview

Unlock the power of digital arithmetic circuits with the Texas Instruments SN74HC148DR. Manufactured with the highest quality standards, this product offers unmatched reliability and performance. Ideal for a wide range of applications, this eight-bit device is perfect for those seeking precision and efficiency in their projects. With a compact design and advanced technology, the SN74HC148DR provides customers with value, benefits, and advantages that set it apart from the competition. Trust Texas Instruments to deliver top-notch solutions for all your digital circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness.

Propagation Delay At Nominal Supply: 49 ns

Low propagation delay ensures efficient and quick processing of data.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape simplifies the design and integration of the circuit into electronic devices.

No. of Bits: 8

Provides precise and accurate calculations for various digital arithmetic operations.

Nominal Supply Voltage / Vsup: 5V

Standard supply voltage that is widely compatible with other electronic components.

Load Capacitance (CL): 50 pF

Helps in stabilizing the voltage supply and reducing noise in the circuit.

Power Supplies (V): 2/6

Allows for flexibility in power input options depending on the application requirements.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components in the circuit.

Package Style (Meter): SMALL OUTLINE

Compact size saves space and makes it suitable for applications with space constraints.

Maximum I (ol): 5.2 Amp

Can handle high output current, making it suitable for applications requiring power.

Propagation Delay (tpd): 240 ns

Low propagation delay ensures quick response time for arithmetic operations.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without any performance issues.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides good conductivity and corrosion resistance for reliable performance.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options on the PCB.

Maximum Seated Height: 1.75 mm

Low profile design is suitable for applications with height restrictions.

Width: 3.9 mm

Compact width saves space on the PCB.

Output Polarity: INVERTED

Supports both inverted and non-inverted output signals for flexibility in design.

Minimum Supply Voltage (Vsup): 2V

Can operate at low voltages, suitable for battery-powered devices.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering processes during assembly.

Length: 9.9 mm

Compact length makes it suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals allow for easy inspection and soldering during assembly.

Packing Method: TR

Tape and reel packaging for efficient handling and assembly.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy PCB layout and assembly.

Maximum Supply Voltage (Vsup): 6V

Can safely handle higher supply voltages for robust performance.

Maximum Power Supply Current (ICC): 0.08 mA

Low power consumption for energy-efficient operation.

Technical Specifications

Digital Arithmetic Circuits SN74HC148DR attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

8 TO 3 LINE PRIORITY ENCODER; CASCADABLE; WITH GROUP SELECT OUTPUT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

49 ns

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74HC148DR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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