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SN74AS181ADW3

Texas Instruments

SN74AS181ADW3 by Texas Instruments

SN74AS181ADW3 by Texas Instruments is a TTL digital arithmetic circuit with 24 terminals in a small outline package. It operates b/w 0°C to 70°C, suitable for commercial applications. This surface-mount IC is designed for arithmetic operations in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,421 parts In-Stock

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8,421

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Digiode

USA . 3,045 parts In-Stock

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3,045

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Distributors (Availability)

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Andel Nordic

Denmark . 293 parts In-Stock

1+ parts

$4.994

100+ parts

-

1k+ parts

$4.794

10k+ parts

$4.794

293

$4.994

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$4.794

$4.794

AZTECH Wire

Italy . 388 parts In-Stock

1+ parts

$6.965

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388

$6.965

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Parana Technologies

USA . 970 parts In-Stock

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$17.618

100+ parts

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$17.809

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970

$17.618

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$17.809

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ChromeModa Solutions

Germany . 4,382 parts In-Stock

1+ parts

$19.796

100+ parts

$16.233

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4,382

$19.796

$16.233

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IDEA Electronic Components Group

UK . 753 parts In-Stock

1+ parts

$19.796

100+ parts

$18.806

1k+ parts

$17.816

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753

$19.796

$18.806

$17.816

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One Stop Electronics

USA . 885 parts In-Stock

1+ parts

$57.000

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885

$57.000

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Corphita

USA . 3,865 parts In-Stock

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3,865

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DigiPath Technology Company

USA . 940 parts In-Stock

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$17.848

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940

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$17.848

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Overview

Unlock the power of digital arithmetic circuits with the SN74AS181ADW3 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions for a wide range of applications. Designed for efficiency and performance, this small outline package offers ease of installation and operation. From commercial to industrial settings, this TTL technology provides seamless integration for your projects. Trust in Texas Instruments to elevate your digital arithmetic capabilities and experience the value and benefits firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the internal components of the circuit, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: RECTANGULAR

Rectangular shape is a common and versatile form factor that is easy to integrate into various electronic devices.

No. of Terminals: 24

With 24 terminals, this circuit can handle complex arithmetic operations and data processing efficiently.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board and allows for compact designs in electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this circuit can withstand high temperature environments without performance degradation.

Minimum Operating Temperature: 0 °C

The circuit can operate effectively in low temperature conditions down to 0°C, making it suitable for a wide range of applications.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit board layout and allow for easier connection to other components.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance under standard operating conditions in commercial applications.

Technology: TTL

TTL technology offers fast and reliable digital signal processing, making this circuit suitable for high-speed arithmetic calculations.

Terminal Form: GULL WING

Gull wing terminal form makes soldering and connection easier, improving the overall reliability and lifespan of the circuit.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this circuit allows for high-density mounting and compact circuit board designs.

Technical Specifications

Digital Arithmetic Circuits SN74AS181ADW3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS181ADW3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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