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SN74S181J4

Texas Instruments

SN74S181J4 by Texas Instruments

SN74S181J4 by Texas Instruments is a TTL digital arithmetic circuit with 24 terminals in an inline rectangular ceramic package. It operates b/w 0°C to 70°C, suitable for commercial applications requiring dual terminal positions. With a terminal pitch of 2.54mm, it offers precise calculations in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,024 parts In-Stock

1+ parts

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6,024

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Digiode

USA . 486 parts In-Stock

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486

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 221 parts In-Stock

1+ parts

$4.000

100+ parts

-

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221

$4.000

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AZTECH Wire

Italy . 798 parts In-Stock

1+ parts

$7.423

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798

$7.423

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Andel Nordic

Denmark . 3,026 parts In-Stock

1+ parts

$8.752

100+ parts

-

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$8.402

10k+ parts

$8.402

3,026

$8.752

-

$8.402

$8.402

Parana Technologies

USA . 755 parts In-Stock

1+ parts

$28.723

100+ parts

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$51.041

10k+ parts

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755

$28.723

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$51.041

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DigiPath Technology Company

USA . 516 parts In-Stock

1+ parts

$31.628

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516

$31.628

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ChromeModa Solutions

Germany . 2,869 parts In-Stock

1+ parts

$32.273

100+ parts

$26.464

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2,869

$32.273

$26.464

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IDEA Electronic Components Group

UK . 155 parts In-Stock

1+ parts

$32.273

100+ parts

$30.659

1k+ parts

$29.046

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155

$32.273

$30.659

$29.046

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Corphita

USA . 1,686 parts In-Stock

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1,686

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Overview

Elevate your digital arithmetic circuits with the SN74S181J4 by Texas Instruments. Crafted with precision and quality, this product offers unmatched performance and reliability in a wide range of applications. From data processing to control systems, this versatile component is designed to deliver superior results every time. Trust in Texas Instruments to provide cutting-edge technology and innovative solutions that bring value and benefits to our customers. Choose the SN74S181J4 for top-notch quality and unparalleled advantages in your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic materials provide excellent stability and durability, making the product suitable for high temperature applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into circuit designs.

No. of Terminals: 24

Having 24 terminals provides flexibility in connecting various components and peripherals to the circuit.

Package Style (Meter): IN-LINE

The in-line package style allows for easy installation and connection in a linear fashion, simplifying circuit design.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can function reliably in elevated temperature environments.

Minimum Operating Temperature: 0 °C

A low minimum operating temperature ensures the product can start up and operate effectively in cooler environments.

Terminal Position: DUAL

Dual terminal position offers redundancy and increased reliability in signal transmission.

Temperature Grade: COMMERCIAL

Commercial grade temperature rating ensures the product is suitable for standard commercial applications.

Technology: TTL

TTL technology provides reliable and fast digital signal processing, making the product suitable for high-speed applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals make it easy to solder the product onto a circuit board, providing a secure and durable connection.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm enables easy integration with other components on a circuit board, ensuring compatibility with existing designs.

Technical Specifications

Digital Arithmetic Circuits SN74S181J4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74S181J4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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