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SN54S280W-10

Texas Instruments

SN54S280W-10 by Texas Instruments

SN54S280W-10 by Texas Instruments is a 9-bit digital arithmetic circuit with a propagation delay of 18 ns. It operates in a temperature range from -55 to 125 °C and has a max power supply current of 99 mA. Ideal for military applications, this TTL technology chip comes in a flatpack package style with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,471 parts In-Stock

1+ parts

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3,471

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Digiode

USA . 1,922 parts In-Stock

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1,922

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Distributors (Availability)

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AZTECH Wire

Italy . 492 parts In-Stock

1+ parts

$5.863

100+ parts

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492

$5.863

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Andel Nordic

Denmark . 660 parts In-Stock

1+ parts

$6.027

100+ parts

-

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$5.786

10k+ parts

$5.786

660

$6.027

-

$5.786

$5.786

Parana Technologies

USA . 1,889 parts In-Stock

1+ parts

$21.738

100+ parts

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$22.188

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1,889

$21.738

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$22.188

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DigiPath Technology Company

USA . 2,088 parts In-Stock

1+ parts

$23.936

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2,088

$23.936

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ChromeModa Solutions

Germany . 3,685 parts In-Stock

1+ parts

$24.425

100+ parts

$20.028

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3,685

$24.425

$20.028

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IDEA Electronic Components Group

UK . 1,078 parts In-Stock

1+ parts

$24.425

100+ parts

$23.204

1k+ parts

$21.982

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1,078

$24.425

$23.204

$21.982

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One Stop Electronics

USA . 1,224 parts In-Stock

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$39.000

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1,224

$39.000

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Corphita

USA . 809 parts In-Stock

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809

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Overview

Unleash the power of cutting-edge digital arithmetic circuits with the SN54S280W-10 by Texas Instruments. Crafted with precision and expertise, this high-quality product offers unparalleled performance and reliability. Ideal for a wide range of applications, this product provides seamless integration and efficient operation. Experience the value of superior technology and innovation with the SN54S280W-10, designed to exceed expectations and deliver exceptional results. Elevate your projects with Texas Instruments and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This package material provides durability and protection for the internal components, making the product reliable in various operating conditions.

No. of Bits: 9

With 9 bits, this digital arithmetic circuit can handle complex calculations and provide accurate results for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Propogation Delay (tpd): 18 ns

The low propagation delay of 18ns enables fast processing of data, making this product suitable for applications requiring quick results.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that the product can operate reliably in extreme temperature conditions, making it ideal for mission-critical applications.

Technical Specifications

Digital Arithmetic Circuits SN54S280W-10 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

ODD/EVEN PARITY GENERATOR

Family:

S

JESD-30 Code:

R-GDFP-F14

Length:

9.21 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

99 mA

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.29 mm

Trade Compliance

SN54S280W-10 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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