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CD74HC85NSR96

Texas Instruments

CD74HC85NSR96 by Texas Instruments

CD74HC85NSR96 by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 295 ns. Operating b/w -55 to 125 °C, it has a supply voltage range of 2-6 V and comes in a small outline package. Ideal for military-grade applications requiring true output polarity and CMOS technology.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 3,621 parts In-Stock

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Digiode

USA . 2,966 parts In-Stock

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AZTECH Wire

Italy . 888 parts In-Stock

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$7.296

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Native Components

USA . 185 parts In-Stock

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$8.790

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Northwest PG Solutions

USA . 370 parts In-Stock

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$9.669

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Parana Technologies

USA . 1,548 parts In-Stock

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DigiPath Technology Company

USA . 1,244 parts In-Stock

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$24.380

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ChromeModa Solutions

Germany . 5,315 parts In-Stock

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$24.878

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IDEA Electronic Components Group

UK . 2,143 parts In-Stock

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One Stop Electronics

USA . 664 parts In-Stock

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Corphita

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Andel Nordic

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Overview

Elevate your digital arithmetic circuits with the CD74HC85NSR96 from Texas Instruments, a high-quality manufacturer known for its reliable and innovative products. This versatile component offers customers a seamless experience with its surface mount design, small outline package style, and true output polarity. Ideal for military-grade applications, this 4-bit circuit boasts a fast propagation delay of 295 ns, ensuring efficient performance in a wide range of temperatures. Experience the value and benefits of Texas Instruments' cutting-edge technology with the CD74HC85NSR96.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, the package body material is lightweight and durable, making it ideal for portable devices.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and space.

No. of Bits: 4

With 4 bits, this digital arithmetic circuit can perform calculations with higher precision and accuracy.

Nominal Supply Voltage: 4.5V

The nominal supply voltage of 4.5V ensures stable and reliable performance of the circuit.

Propagation Delay: 295ns

The low propagation delay of 295ns enables quick processing of arithmetic operations, improving overall efficiency.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this circuit can withstand high temperatures and harsh environments.

Technology: CMOS

The CMOS technology used in this circuit allows for low power consumption and high noise immunity, enhancing its performance.

Technical Specifications

Digital Arithmetic Circuits CD74HC85NSR96 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/6

Propagation Delay (tpd):

295 ns

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

CD74HC85NSR96 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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