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CD40147BPW

Texas Instruments

CD40147BPW by Texas Instruments

CD40147BPW by Texas Instruments is a 10-bit digital arithmetic circuit with 900 ns propagation delay. It operates at a supply voltage of 5V and supports power supplies of 5/15V. Ideal for military applications due to its CMOS technology and wide temperature range from -55 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,329 parts In-Stock

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4,329

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Vyrian

USA . 3,078 parts In-Stock

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3,078

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Distributors (Availability)

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Native Components

USA . 145 parts In-Stock

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$0.041

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-

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$0.039

145

$0.041

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$0.039

AZTECH Wire

Italy . 328 parts In-Stock

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$7.375

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328

$7.375

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Andel Nordic

Denmark . 1,941 parts In-Stock

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$9.603

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$9.219

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$9.219

1,941

$9.603

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$9.219

$9.219

Parana Technologies

USA . 1,505 parts In-Stock

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$18.500

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$18.614

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$18.500

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One Stop Electronics

USA . 734 parts In-Stock

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$19.000

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734

$19.000

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ChromeModa Solutions

Germany . 1,062 parts In-Stock

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$20.787

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$17.045

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$20.787

$17.045

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IDEA Electronic Components Group

UK . 755 parts In-Stock

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$20.787

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$19.748

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$18.708

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755

$20.787

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$18.708

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DigiPath Technology Company

USA . 1,400 parts In-Stock

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$18.742

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$18.742

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Northwest PG Solutions

USA . 1,079 parts In-Stock

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1,079

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Microchip USA

USA . 349 parts In-Stock

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Corphita

USA . 164 parts In-Stock

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Overview

Elevate your digital arithmetic circuits with the CD40147BPW by Texas Instruments. Crafted with precision and expertise, this product boasts high-quality construction and reliable performance. Ideal for various applications in industries such as aerospace, defense, and telecommunications, this innovative device offers unparalleled value and benefits to customers. Experience enhanced efficiency and accuracy with the CD40147BPW, a game-changer in the world of digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and mechanical protection, making the product durable and long-lasting.

No. of Bits: 10

Having 10 bits allows for a wide range of calculations and precision in arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with many existing systems and easy to integrate.

Propagation Delay (tpd): 900 ns

With a low propagation delay, calculations can be performed quickly and efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Digital Arithmetic Circuits CD40147BPW attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Logic IC Type:

No. of Bits:

10

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay (tpd):

900 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

CD40147BPW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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