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SN74HC148FN3

Texas Instruments

SN74HC148FN3 by Texas Instruments

SN74HC148FN3 by Texas Instruments is a CMOS digital arithmetic circuit with 20 terminals in a square chip carrier package. Operating temperature ranges from -40°C to 85°C, making it suitable for industrial applications. It has power supplies of 2-6V and is surface mountable, ideal for various electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,564 parts In-Stock

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5,564

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Digiode

USA . 1,339 parts In-Stock

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1,339

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,284 parts In-Stock

1+ parts

$2.645

100+ parts

-

1k+ parts

$2.539

10k+ parts

$2.539

1,284

$2.645

-

$2.539

$2.539

AZTECH Wire

Italy . 352 parts In-Stock

1+ parts

$15.654

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352

$15.654

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Parana Technologies

USA . 1,248 parts In-Stock

1+ parts

$25.596

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$26.209

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1,248

$25.596

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$26.209

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DigiPath Technology Company

USA . 1,643 parts In-Stock

1+ parts

$28.184

100+ parts

$25.929

1k+ parts

-

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1,643

$28.184

$25.929

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ChromeModa Solutions

Germany . 6,124 parts In-Stock

1+ parts

$28.759

100+ parts

$23.582

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6,124

$28.759

$23.582

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IDEA Electronic Components Group

UK . 1,661 parts In-Stock

1+ parts

$28.759

100+ parts

$27.321

1k+ parts

$25.883

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1,661

$28.759

$27.321

$25.883

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One Stop Electronics

USA . 1,297 parts In-Stock

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$53.000

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1,297

$53.000

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Corphita

USA . 3,588 parts In-Stock

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3,588

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Overview

Unlock the power of precision and efficiency with the SN74HC148FN3 by Texas Instruments. Crafted with superior quality and cutting-edge technology, this digital arithmetic circuit offers unparalleled performance in a compact square package. Ideal for industrial applications, this chip carrier ensures reliability and accuracy in every operation. Trust Texas Instruments to deliver excellence in electronic components and experience the difference with the SN74HC148FN3 - where value meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, making it suitable for portable applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration of the product onto a circuit board, saving space and simplifying assembly.

Package Shape: SQUARE

The square package shape ensures uniformity in size and facilitates easier placement and orientation during manufacturing and assembly processes.

Power Supplies (V): 2/6

The product supports a wide range of power supply voltages (2V to 6V), providing flexibility in different application scenarios.

No. of Terminals: 20

With 20 terminals available, the product offers versatility in connectivity options and allows for more complex circuit configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style helps in efficient heat dissipation and electromagnetic shielding, ensuring reliable operation under various operating conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to withstand elevated temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product's functionality in extreme cold environments, expanding its range of use cases.

Terminal Position: QUAD

The quad terminal position provides stability and ease of connection, enhancing the reliability and performance of the product in demanding applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification confirms the product's reliability and ruggedness for use in harsh industrial environments with temperature fluctuations.

Technology: CMOS

The use of CMOS technology in the product ensures low power consumption, high noise immunity, and compatibility with various digital devices, enhancing overall efficiency.

Terminal Form: J BEND

The J bend terminal form simplifies the soldering process and improves the mechanical stability of connections, ensuring secure and reliable electrical contact.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for compact spacing between terminals, enabling high-density packaging and reducing the overall footprint of the product.

Technical Specifications

Digital Arithmetic Circuits SN74HC148FN3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74HC148FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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