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SN54LS636FK

Texas Instruments

SN54LS636FK by Texas Instruments

SN54LS636FK by Texas Instruments is an 8-bit digital arithmetic circuit with TTL technology. It operates b/w -55 to 125 °C and has a supply voltage range of 4.5V to 5.5V, drawing a max current of 160mA. This chip carrier package with 20 terminals is suitable for military-grade applications requiring high-speed data processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,699 parts In-Stock

1+ parts

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7,699

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Digiode

USA . 3,951 parts In-Stock

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3,951

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Distributors (Availability)

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Andel Nordic

Denmark . 2,201 parts In-Stock

1+ parts

$6.282

100+ parts

-

1k+ parts

$6.031

10k+ parts

$6.031

2,201

$6.282

-

$6.031

$6.031

AZTECH Wire

Italy . 201 parts In-Stock

1+ parts

$12.917

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-

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201

$12.917

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Parana Technologies

USA . 962 parts In-Stock

1+ parts

$18.945

100+ parts

-

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$19.010

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962

$18.945

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$19.010

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DigiPath Technology Company

USA . 752 parts In-Stock

1+ parts

$20.860

100+ parts

$19.191

1k+ parts

-

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752

$20.860

$19.191

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ChromeModa Solutions

Germany . 2,096 parts In-Stock

1+ parts

$21.286

100+ parts

$17.455

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2,096

$21.286

$17.455

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IDEA Electronic Components Group

UK . 1,211 parts In-Stock

1+ parts

$21.286

100+ parts

$20.222

1k+ parts

$19.157

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1,211

$21.286

$20.222

$19.157

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One Stop Electronics

USA . 429 parts In-Stock

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$27.000

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429

$27.000

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Corphita

USA . 1,549 parts In-Stock

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1,549

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Overview

Unlock the power of digital arithmetic circuits with the Texas Instruments SN54LS636FK. Known for its quality and reliability, Texas Instruments is a trusted manufacturer in the industry. This versatile chip carrier offers 8 bits of precision, making it ideal for a wide range of applications. With a nominal supply voltage of 5V and a temperature grade of military, the SN54LS636FK delivers exceptional performance in extreme conditions. Experience the value and benefits this product brings to your projects, from improved efficiency to enhanced functionality. Elevate your designs with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making it suitable for harsh environments.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

No. of Bits: 8

Provides sufficient precision for digital arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement for compatibility with most systems.

Temperature Grade: MILITARY

Designed to meet stringent military grade specifications for reliability.

Technical Specifications

Digital Arithmetic Circuits SN54LS636FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

45 pF

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

160 mA

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

SN54LS636FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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