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CY74FCT480BTSOC

Texas Instruments

CY74FCT480BTSOC by Texas Instruments

CY74FCT480BTSOC by Texas Instruments is an 8-bit digital arithmetic circuit with 2 functions, operating at a supply voltage of 5V. With a propagation delay of 6.1ns, it is ideal for industrial applications requiring inverted output polarity and open-drain characteristics. This CMOS technology chip comes in a small outline package measuring 15.4mm x 7.5mm, suitable for surface mount assembly.

Median Price

$10.775

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 50,152 parts In-Stock

1+ parts

-

100+ parts

$8.620

1k+ parts

$7.710

10k+ parts

$7.260

50,152

-

$8.620

$7.710

$7.260

Verical

USA . 22,085 parts In-Stock

1+ parts

-

100+ parts

$10.775

1k+ parts

$9.637

10k+ parts

$9.075

22,085

-

$10.775

$9.637

$9.075

DigiKey

USA . 3,120 parts In-Stock

1+ parts

-

100+ parts

$11.340

1k+ parts

-

10k+ parts

-

3,120

-

$11.340

-

-

Distributors (In-Stock)

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Digiode

USA . 250 parts In-Stock

1+ parts

$9.092

100+ parts

-

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-

250

$9.092

-

-

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Vyrian

USA . 2,660 parts In-Stock

1+ parts

$9.570

100+ parts

-

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-

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2,660

$9.570

-

-

-

DigiKey Marketplace

USA . 3,120 parts In-Stock

1+ parts

-

100+ parts

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3,120

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-

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First Choice Components Inc.

USA . 456 parts In-Stock

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456

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 143 parts In-Stock

1+ parts

$0.267

100+ parts

-

1k+ parts

-

10k+ parts

$0.256

143

$0.267

-

-

$0.256

Northwest PG Solutions

USA . 2,222 parts In-Stock

1+ parts

$0.294

100+ parts

-

1k+ parts

-

10k+ parts

$0.259

2,222

$0.294

-

-

$0.259

Andel Nordic

Denmark . 4,325 parts In-Stock

1+ parts

$3.706

100+ parts

-

1k+ parts

$3.558

10k+ parts

$3.558

4,325

$3.706

-

$3.558

$3.558

Corphita

USA . 3,157 parts In-Stock

1+ parts

$8.613

100+ parts

-

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3,157

$8.613

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Parana Technologies

USA . 217 parts In-Stock

1+ parts

$23.223

100+ parts

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$23.855

10k+ parts

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217

$23.223

-

$23.855

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DigiPath Technology Company

USA . 125 parts In-Stock

1+ parts

$25.571

100+ parts

$23.525

1k+ parts

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125

$25.571

$23.525

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Microchip USA

USA . 1,348 parts In-Stock

1+ parts

$25.704

100+ parts

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1,348

$25.704

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ChromeModa Solutions

Germany . 4,166 parts In-Stock

1+ parts

$26.093

100+ parts

$21.396

1k+ parts

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10k+ parts

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4,166

$26.093

$21.396

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IDEA Electronic Components Group

UK . 413 parts In-Stock

1+ parts

$26.093

100+ parts

$24.788

1k+ parts

$23.484

10k+ parts

-

413

$26.093

$24.788

$23.484

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Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

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3,790

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 511 parts In-Stock

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511

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Overview

Looking for top-quality digital arithmetic circuits? Look no further than the CY74FCT480BTSOC by Texas Instruments. With a reputation for excellence in semiconductor manufacturing, Texas Instruments delivers reliable and efficient products. This versatile circuit offers 8 bits of functionality in a compact package, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this product provides unmatched value and performance. Upgrade your designs with the CY74FCT480BTSOC and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

No. of Functions: 2

Having 2 functions provides flexibility and enhances the functionality of the circuit.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

No. of Bits: 8

8 bits ensure higher resolution and accuracy in digital calculations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with typical electronic systems.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable performance.

No. of Terminals: 24

Having 24 terminals allows for multiple connections and integration into complex circuits.

Package Style (Meter): SMALL OUTLINE

Small outline package makes it suitable for space-constrained applications.

Propagation Delay (tpd): 6.1 ns

Low propagation delay of 6.1 ns ensures fast and efficient operation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows for reliable performance in various environments.

Output Characteristics: OPEN-DRAIN

Open-drain output allows for easy interfacing with other devices.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures functionality in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides good conductivity and corrosion resistance.

Terminal Position: DUAL

Having dual terminal positions allows for flexible placement on the circuit board.

Maximum Seated Height: 2.65 mm

Low seated height of 2.65 mm saves space and allows for compact design.

Width: 7.5 mm

Narrow width of 7.5 mm allows for dense packing on the circuit board.

Output Polarity: INVERTED

Inverted output polarity may be beneficial in certain digital signal processing applications.

Minimum Supply Voltage (Vsup): 4.75 V

Having a minimum supply voltage of 4.75V ensures reliable operation even with slight voltage fluctuations.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for up to 30 seconds, ensuring proper soldering during assembly.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for reliable soldering during assembly.

Length: 15.4 mm

Length of 15.4 mm provides a compact form factor for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature range applications, ensuring durability and reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and reliable electrical connections.

Terminal Pitch: 1.27 mm

Having a terminal pitch of 1.27 mm allows for precise placement on the circuit board.

Maximum Supply Voltage (Vsup): 5.25 V

With a maximum supply voltage of 5.25V, the device can handle slight voltage spikes without damage.

Technical Specifications

Digital Arithmetic Circuits CY74FCT480BTSOC attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

6.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

CY74FCT480BTSOC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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