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CY74FCT480BTSOCTE4

Texas Instruments

CY74FCT480BTSOCTE4 by Texas Instruments

PARITY GENERATOR/CHECKER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,772 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,772

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Vyrian

USA . 2,423 parts In-Stock

1+ parts

-

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2,423

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,851 parts In-Stock

1+ parts

$1.663

100+ parts

-

1k+ parts

$1.597

10k+ parts

$1.597

2,851

$1.663

-

$1.597

$1.597

Parana Technologies

USA . 586 parts In-Stock

1+ parts

$10.345

100+ parts

-

1k+ parts

$10.865

10k+ parts

-

586

$10.345

-

$10.865

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ChromeModa Solutions

Germany . 4,925 parts In-Stock

1+ parts

$11.624

100+ parts

$9.532

1k+ parts

-

10k+ parts

-

4,925

$11.624

$9.532

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IDEA Electronic Components Group

UK . 1,494 parts In-Stock

1+ parts

$11.624

100+ parts

$11.043

1k+ parts

$10.462

10k+ parts

-

1,494

$11.624

$11.043

$10.462

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AZTECH Wire

Italy . 300 parts In-Stock

1+ parts

$11.790

100+ parts

-

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10k+ parts

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300

$11.790

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Modulus Dynamics

Lithuania . 100 parts In-Stock

1+ parts

$36.416

100+ parts

$36.416

1k+ parts

$36.416

10k+ parts

-

100

$36.416

$36.416

$36.416

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One Stop Electronics

USA . 579 parts In-Stock

1+ parts

$42.000

100+ parts

-

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579

$42.000

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Corphita

USA . 4,205 parts In-Stock

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4,205

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Northwest PG Solutions

USA . 1,904 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.710

10k+ parts

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1,904

-

-

$3.710

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DigiPath Technology Company

USA . 1,248 parts In-Stock

1+ parts

-

100+ parts

$10.480

1k+ parts

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10k+ parts

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1,248

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$10.480

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Native Components

USA . 694 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.672

10k+ parts

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694

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$3.672

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Microchip USA

USA . 412 parts In-Stock

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412

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Technical Specifications

Digital Arithmetic Circuits CY74FCT480BTSOCTE4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

6.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

CY74FCT480BTSOCTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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