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SN74HC678NTP3

Texas Instruments

SN74HC678NTP3 by Texas Instruments

SN74HC678NTP3 by Texas Instruments is a CMOS digital arithmetic circuit with 24 terminals in an in-line rectangular package. It operates b/w -40°C to 85°C, making it suitable for industrial applications requiring precise calculations and data processing. The through-hole terminal form and 2.54mm pitch enhance its reliability in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,171 parts In-Stock

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Digiode

USA . 1,897 parts In-Stock

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1,897

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Distributors (Availability)

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AZTECH Wire

Italy . 302 parts In-Stock

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$7.302

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302

$7.302

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Parana Technologies

USA . 1,616 parts In-Stock

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$11.196

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$11.637

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1,616

$11.196

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$11.637

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DigiPath Technology Company

USA . 1,267 parts In-Stock

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$12.328

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$11.342

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1,267

$12.328

$11.342

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ChromeModa Solutions

Germany . 3,895 parts In-Stock

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$12.580

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$10.316

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3,895

$12.580

$10.316

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IDEA Electronic Components Group

UK . 632 parts In-Stock

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$12.580

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$11.951

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$11.322

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632

$12.580

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$11.322

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One Stop Electronics

USA . 1,264 parts In-Stock

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$15.000

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Corphita

USA . 1,304 parts In-Stock

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Overview

Experience the unbeatable quality and reliability of Texas Instruments with the SN74HC678NTP3 digital arithmetic circuit. This versatile component is perfect for a wide range of applications, offering unmatched performance and precision. Whether you're designing industrial equipment or consumer electronics, this product delivers exceptional value and efficiency. Trust Texas Instruments to provide you with the cutting-edge technology you need to succeed in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the circuit components, ensuring reliability and durability.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate this product into existing systems or circuit layouts.

No. of Terminals: 24

Having a sufficient number of terminals allows for complex circuit connections and functions to be implemented.

Package Style (Meter): IN-LINE

The in-line package style saves space and simplifies wiring, making installation and maintenance easier.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can handle demanding industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to operate reliably in a wide range of temperature conditions.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit layout and connection options.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product is built to withstand tough conditions and operate consistently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust connections and are easy to solder, ensuring secure and reliable circuit connections.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy connection with standard components and PCB layouts, simplifying assembly and integration.

Technical Specifications

Digital Arithmetic Circuits SN74HC678NTP3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC678NTP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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