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SN54HC283FH

Texas Instruments

SN54HC283FH by Texas Instruments

SN54HC283FH by Texas Instruments is a CMOS digital arithmetic circuit in a ceramic chip carrier package. It operates b/w -55°C to 125°C, with power supplies of 2V to 6V. With 20 terminals and surface mount capability, it's ideal for military-grade applications requiring high-temperature performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,797 parts In-Stock

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5,797

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Digiode

USA . 1,068 parts In-Stock

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1,068

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Distributors (Availability)

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Andel Nordic

Denmark . 86 parts In-Stock

1+ parts

$8.359

100+ parts

-

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$8.025

10k+ parts

$8.025

86

$8.359

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$8.025

$8.025

AZTECH Wire

Italy . 249 parts In-Stock

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$9.630

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249

$9.630

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Parana Technologies

USA . 1,582 parts In-Stock

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$12.603

100+ parts

$1,170.407

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$11.343

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1,582

$12.603

$1,170.407

$11.343

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DigiPath Technology Company

USA . 439 parts In-Stock

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$13.878

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439

$13.878

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ChromeModa Solutions

Germany . 6,739 parts In-Stock

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$14.161

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$11.612

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6,739

$14.161

$11.612

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IDEA Electronic Components Group

UK . 1,803 parts In-Stock

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$14.161

100+ parts

$13.453

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$12.745

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1,803

$14.161

$13.453

$12.745

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One Stop Electronics

USA . 1,110 parts In-Stock

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$18.000

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$18.000

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Corphita

USA . 3,791 parts In-Stock

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3,791

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Overview

Elevate your digital arithmetic circuits with the SN54HC283FH from Texas Instruments. Known for their high-quality products, Texas Instruments offers reliability and performance in every component. This chip carrier package boasts a ceramic body material and surface mount capability, making it versatile for a wide range of applications. With a maximum operating temperature of 125°C and military-grade durability, this CMOS technology device is built to last. Trust Texas Instruments to deliver the value and benefits you need for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic provides high thermal conductivity and excellent resistance to corrosion, making it a reliable choice for electronic circuits that require good heat dissipation and durability.

Surface Mount: YES

Surface mount technology allows for compact and efficient assembly of the circuit, saving space and reducing manufacturing costs.

Package Shape: SQUARE

Square package shape facilitates easier handling and mounting on circuit boards, ensuring proper alignment and reducing the risk of errors during installation.

Power Supplies (V): 2/6

Support for multiple power supply voltages (2V and 6V) provides flexibility in design and compatibility with various system requirements.

No. of Terminals: 20

Having 20 terminals allows for more connectivity options and interfaces, enabling the circuit to interact with other components or systems efficiently.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers protection for the delicate integrated circuits, ensuring reliability and longevity of the digital arithmetic circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand demanding conditions and maintain performance in harsh environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C makes this product suitable for use in cold environments or applications that require reliable operation under extreme conditions.

Terminal Position: QUAD

Quad terminal positioning allows for more efficient routing of signals and reduces crosstalk, ensuring optimal performance of the digital arithmetic circuits.

Temperature Grade: MILITARY

Military-grade temperature rating ensures that the product meets stringent reliability and performance standards required for mission-critical applications in defense or aerospace industries.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it an energy-efficient and versatile choice for digital arithmetic circuits.

Terminal Form: NO LEAD

No-lead terminal form eliminates the risk of lead contamination and enhances the product's environmental friendliness, meeting modern regulatory requirements for sustainable electronics manufacturing.

Terminal Pitch: 1.27 mm

Having a terminal pitch of 1.27mm enables precise and secure connections on the circuit board, ensuring reliable signal transmission and reducing the risk of signal interference or loss.

Technical Specifications

Digital Arithmetic Circuits SN54HC283FH attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2/6

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN54HC283FH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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