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SNJ54ALS677FH-00

Texas Instruments

SNJ54ALS677FH-00 by Texas Instruments

SNJ54ALS677FH-00 by Texas Instruments is a 16-bit digital arithmetic circuit with a supply voltage of 5V and propagation delay of 40ns. It is used in military-grade applications, operates b/w -55 to 125°C, and has a package style of chip carrier.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,683 parts In-Stock

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5,683

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Digiode

USA . 182 parts In-Stock

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182

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Distributors (Availability)

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Andel Nordic

Denmark . 143 parts In-Stock

1+ parts

$2.600

100+ parts

-

1k+ parts

$2.496

10k+ parts

$2.496

143

$2.600

-

$2.496

$2.496

AZTECH Wire

Italy . 603 parts In-Stock

1+ parts

$5.148

100+ parts

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603

$5.148

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Parana Technologies

USA . 1,401 parts In-Stock

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$14.738

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$15.178

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1,401

$14.738

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$15.178

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DigiPath Technology Company

USA . 1,770 parts In-Stock

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$16.228

100+ parts

$14.930

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1,770

$16.228

$14.930

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IDEA Electronic Components Group

UK . 2,252 parts In-Stock

1+ parts

$16.559

100+ parts

$15.731

1k+ parts

$14.903

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2,252

$16.559

$15.731

$14.903

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ChromeModa Solutions

Germany . 1,269 parts In-Stock

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$16.559

100+ parts

$13.578

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1,269

$16.559

$13.578

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One Stop Electronics

USA . 426 parts In-Stock

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$55.000

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426

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Corphita

USA . 500 parts In-Stock

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500

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Overview

Unleash the power of cutting-edge digital arithmetic circuits with the SNJ54ALS677FH-00 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers top-notch products that exceed expectations. The SNJ54ALS677FH-00 offers customers unmatched value and benefits in various applications, thanks to its innovative design and advanced technology. Elevate your projects with this high-performance chip carrier that guarantees fast propagation delay and precise inverted output polarity, setting new standards in digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability to the product, ensuring long-term performance.

No. of Bits: 16

Having 16 bits allows for precise and accurate calculations, making this product suitable for complex arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with a wide range of systems and applications.

Propagation Delay (tpd): 40 ns

With a low propagation delay, this product allows for fast processing speeds, ideal for time-sensitive operations.

Temperature Grade: MILITARY

Being military-grade ensures that this product can withstand harsh environmental conditions, making it suitable for demanding applications.

Technical Specifications

Digital Arithmetic Circuits SNJ54ALS677FH-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH INHIBIT

Family:

ALS

JESD-30 Code:

S-CQCC-N28

Length:

11.43 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

16

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Power Supply Current (ICC):

33 mA

Propagation Delay (tpd):

40 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

SNJ54ALS677FH-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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