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SN74182J4

Texas Instruments

SN74182J4 by Texas Instruments

SN74182J4 by Texas Instruments is a TTL digital arithmetic circuit with 16 terminals in an in-line rectangular ceramic package. It operates b/w 0°C to 70°C, suitable for commercial applications requiring dual terminal positions. With a terminal pitch of 2.54mm, it is ideal for various digital computing and processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,986 parts In-Stock

1+ parts

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5,986

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Digiode

USA . 3,528 parts In-Stock

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3,528

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,624 parts In-Stock

1+ parts

$15.000

100+ parts

-

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1,624

$15.000

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AZTECH Wire

Italy . 610 parts In-Stock

1+ parts

$15.856

100+ parts

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610

$15.856

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Parana Technologies

USA . 537 parts In-Stock

1+ parts

$18.405

100+ parts

-

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$18.527

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537

$18.405

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$18.527

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DigiPath Technology Company

USA . 2,025 parts In-Stock

1+ parts

$20.266

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2,025

$20.266

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IDEA Electronic Components Group

UK . 2,094 parts In-Stock

1+ parts

$20.680

100+ parts

$19.646

1k+ parts

$18.612

10k+ parts

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2,094

$20.680

$19.646

$18.612

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ChromeModa Solutions

Germany . 948 parts In-Stock

1+ parts

$20.680

100+ parts

$16.958

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948

$20.680

$16.958

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Andel Nordic

Denmark . 1,685 parts In-Stock

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1,685

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Corphita

USA . 1,518 parts In-Stock

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1,518

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Overview

Elevate your digital arithmetic circuits with the SN74182J4 by Texas Instruments. Crafted with precision and quality, this product offers unmatched performance and reliability. Designed for a wide range of applications, this component provides seamless integration and exceptional functionality. Experience the value and benefits of Texas Instruments' superior craftsmanship, as you unlock endless possibilities with the SN74182J4. Upgrade your projects today and elevate your success with this innovative solution.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its high temperature resistance and reliability, making it ideal for electronic components that require stable operation in various environments.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space in electronic circuits and provides a standard form factor for easy integration into existing systems.

No. of Terminals: 16

Having 16 terminals allows for the connection of multiple input and output signals, enabling complex arithmetic operations to be performed effectively.

Package Style (Meter): IN-LINE

The in-line package style is commonly used for digital circuits, providing a compact and organized layout that simplifies circuit design and assembly.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this product can withstand demanding environmental conditions without compromising performance.

Minimum Operating Temperature: 0 °C

The ability to operate effectively at 0°C ensures reliable performance even in low-temperature environments, making it a versatile choice for various applications.

Terminal Position: DUAL

Dual terminal position supports efficient signal transmission and connectivity, allowing for seamless integration with other components in a circuit.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this product meets industry standards for performance and reliability in typical operating environments.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making it suitable for high-speed arithmetic calculations in digital circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection to the circuit board, ensuring stable operation and ease of maintenance for the product.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm allows for easy soldering and assembly, making it convenient for circuit prototyping and mass production applications.

Technical Specifications

Digital Arithmetic Circuits SN74182J4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74182J4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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