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SN74HC678JT

Texas Instruments

SN74HC678JT by Texas Instruments

SN74HC678JT by Texas Instruments is a CMOS digital arithmetic circuit with 24 terminals in an IN-LINE package. It operates b/w -40°C to 85°C, making it suitable for industrial applications. The package body material is ceramic, and the terminal form is through-hole with a pitch of 2.54 mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,827 parts In-Stock

1+ parts

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7,827

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Digiode

USA . 3,648 parts In-Stock

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3,648

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 354 parts In-Stock

1+ parts

$8.063

100+ parts

$748.809

1k+ parts

$7.257

10k+ parts

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354

$8.063

$748.809

$7.257

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DigiPath Technology Company

USA . 1,827 parts In-Stock

1+ parts

$8.879

100+ parts

$8.168

1k+ parts

-

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1,827

$8.879

$8.168

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ChromeModa Solutions

Germany . 3,142 parts In-Stock

1+ parts

$9.060

100+ parts

$7.429

1k+ parts

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3,142

$9.060

$7.429

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IDEA Electronic Components Group

UK . 1,167 parts In-Stock

1+ parts

$9.060

100+ parts

$8.607

1k+ parts

$8.154

10k+ parts

-

1,167

$9.060

$8.607

$8.154

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AZTECH Wire

Italy . 239 parts In-Stock

1+ parts

$15.908

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239

$15.908

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One Stop Electronics

USA . 1,562 parts In-Stock

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$62.000

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1,562

$62.000

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Andel Nordic

Denmark . 1,559 parts In-Stock

1+ parts

$116.374

100+ parts

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1k+ parts

$111.719

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$111.719

1,559

$116.374

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$111.719

$111.719

Corphita

USA . 2,504 parts In-Stock

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2,504

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Overview

Unlock the power of digital arithmetic circuits with the SN74HC678JT by Texas Instruments. Crafted with precision and expertise, this high-quality product offers unparalleled performance in a variety of applications. From industrial automation to consumer electronics, this versatile component is designed to deliver reliable results in any environment. Trust Texas Instruments to provide you with the cutting-edge technology you need to stay ahead of the competition. Elevate your projects with the SN74HC678JT and experience the value and benefits that only Texas Instruments can offer.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal conductivity and mechanical strength, making them ideal for high-performance applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into circuit designs.

No. of Terminals: 24

Having 24 terminals allows for complex circuit configurations and connectivity options.

Package Style (Meter): IN-LINE

In-line package style makes it easy to mount and install in a variety of configurations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand extreme conditions and heavy workloads.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature means the product can operate in a wide range of environments.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit connections and layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for digital arithmetic circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and connection reliability.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration with other components and circuit boards.

Technical Specifications

Digital Arithmetic Circuits SN74HC678JT attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC678JT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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