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SNJ54ALS632BFN

Texas Instruments

SNJ54ALS632BFN by Texas Instruments

SNJ54ALS632BFN by Texas Instruments is a 32-bit digital arithmetic circuit with TTL technology. It operates b/w -55°C to 125°C, suitable for military-grade applications. With a supply voltage range of 4.5V to 5.5V, it features 3-STATE output characteristics and comes in a square chip carrier package for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,418 parts In-Stock

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Digiode

USA . 2,251 parts In-Stock

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2,251

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Distributors (Availability)

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Andel Nordic

Denmark . 173 parts In-Stock

1+ parts

$6.263

100+ parts

-

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$6.013

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$6.013

173

$6.263

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$6.013

$6.013

One Stop Electronics

USA . 258 parts In-Stock

1+ parts

$7.000

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258

$7.000

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AZTECH Wire

Italy . 319 parts In-Stock

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$15.199

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319

$15.199

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Parana Technologies

USA . 2,282 parts In-Stock

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$18.456

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$18.574

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2,282

$18.456

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$18.574

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ChromeModa Solutions

Germany . 3,942 parts In-Stock

1+ parts

$20.737

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$17.004

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3,942

$20.737

$17.004

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IDEA Electronic Components Group

UK . 2,023 parts In-Stock

1+ parts

$20.737

100+ parts

$19.700

1k+ parts

$18.663

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2,023

$20.737

$19.700

$18.663

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Corphita

USA . 2,351 parts In-Stock

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DigiPath Technology Company

USA . 845 parts In-Stock

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$18.696

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845

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$18.696

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Overview

Unlock the power of high-quality digital arithmetic circuits with the SNJ54ALS632BFN by Texas Instruments. Manufactured by a trusted industry leader, this product offers unparalleled reliability and performance for a wide range of applications. Whether you're working on military-grade projects or commercial ventures, this chip carrier package delivers 32 bits of precision at your fingertips. With a nominal supply voltage of 5V and 3-state output characteristics, the SNJ54ALS632BFN ensures seamless operation in any environment. Trust Texas Instruments to provide the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the inner components of the digital arithmetic circuit, making it resistant to damage.

Surface Mount: YES

Allows for easy installation and integration into electronic circuits, saving time and effort during assembly.

No. of Bits: 32

Provides a high level of precision and accuracy in calculations, suitable for complex arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, ensuring compatibility with most electronic systems.

No. of Terminals: 68

Offers ample connectivity options for interfacing with other components or systems, enhancing versatility.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for a wide range of operating environments.

Output Characteristics: 3-STATE

Allows the circuit to have multiple output states, providing flexibility in controlling the signal flow.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold conditions, ensuring consistent performance in harsh environments.

Width: 24.2316 mm

Compact size enables efficient use of space on a circuit board, ideal for applications where size constraints are a concern.

Technology: TTL

Uses Transistor-Transistor Logic technology, known for its high speed and reliability in digital circuits.

Technical Specifications

Digital Arithmetic Circuits SNJ54ALS632BFN attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

BUILT IN DIAGNOSTICS; BYTE CONTROL

Family:

ALS

JESD-30 Code:

S-PQCC-J68

Length:

24.2316 mm

No. of Bits:

32

No. of Functions:

1

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.2316 mm

Trade Compliance

SNJ54ALS632BFN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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