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SNJ54ALS526FH-00

Texas Instruments

SNJ54ALS526FH-00 by Texas Instruments

SNJ54ALS526FH-00 by Texas Instruments is a 16-bit digital arithmetic circuit with TTL technology. It operates b/w -55 to 125 °C and has a supply voltage range of 4.5V to 5.5V, making it suitable for military-grade applications requiring inverted output polarity in a square chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,781 parts In-Stock

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Vyrian

USA . 2,419 parts In-Stock

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2,419

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Distributors (Availability)

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Andel Nordic

Denmark . 281 parts In-Stock

1+ parts

$3.672

100+ parts

-

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$3.525

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$3.525

281

$3.672

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$3.525

$3.525

One Stop Electronics

USA . 268 parts In-Stock

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$10.000

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268

$10.000

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AZTECH Wire

Italy . 797 parts In-Stock

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$18.346

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797

$18.346

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Parana Technologies

USA . 1,118 parts In-Stock

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$21.376

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$21.715

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1,118

$21.376

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$21.715

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DigiPath Technology Company

USA . 1,183 parts In-Stock

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$23.538

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1,183

$23.538

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ChromeModa Solutions

Germany . 2,839 parts In-Stock

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$24.018

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$19.695

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2,839

$24.018

$19.695

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IDEA Electronic Components Group

UK . 247 parts In-Stock

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$24.018

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$22.817

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$21.616

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247

$24.018

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$21.616

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Corphita

USA . 3,652 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the SNJ54ALS526FH-00 from Texas Instruments, a leading manufacturer in the industry. This digital arithmetic circuit offers precision and efficiency, perfect for a wide range of applications. Whether you're working on industrial automation, telecommunications, or consumer electronics, this product delivers exceptional value and benefits to meet your needs. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures high durability and reliability, making this product suitable for harsh operating conditions.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs, making it convenient for compact system designs.

No. of Bits: 16

With 16 bits, this digital arithmetic circuit can perform complex calculations and support high precision applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes it compatible with a wide range of systems and power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in demanding environments.

Technology: TTL

Being based on TTL technology, this circuit offers fast switching speeds and low power consumption, ideal for efficient arithmetic operations.

Technical Specifications

Digital Arithmetic Circuits SNJ54ALS526FH-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

FUSE-PROGRAMMABLE PORT B INPUTS; CASCADABLE

Family:

ALS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Logic IC Type:

No. of Bits:

16

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SNJ54ALS526FH-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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