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SNJ54147J

Texas Instruments

SNJ54147J by Texas Instruments

SNJ54147J by Texas Instruments is a 9-bit digital arithmetic circuit with a propagation delay of 19ns. Operating at a supply voltage of 5V, it is designed for military-grade applications with a temperature range from -55°C to 125°C. The package style is in-line, with 16 terminals and a max power supply current of 70mA.

Median Price

$5.844

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 3 parts In-Stock

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Vyrian

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Digiode

USA . 2,538 parts In-Stock

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R&J Components

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MISTER SPROCKETS

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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Electronic Expediters

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Resion

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AZTECH Wire

Italy . 671 parts In-Stock

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$6.174

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Andel Nordic

Denmark . 522 parts In-Stock

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$11.083

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$10.639

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One Stop Electronics

USA . 188 parts In-Stock

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Parana Technologies

USA . 1,427 parts In-Stock

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DigiPath Technology Company

USA . 221 parts In-Stock

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$31.835

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ChromeModa Solutions

Germany . 322 parts In-Stock

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IDEA Electronic Components Group

UK . 304 parts In-Stock

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Corphita

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Overview

Unleash the power of cutting-edge digital arithmetic circuits with the SNJ54147J by Texas Instruments. Proudly manufactured by a renowned industry leader, this versatile component offers unparalleled quality and reliability. Perfect for a wide range of applications, this product provides exceptional value and benefits to customers looking for efficient and precise performance. Upgrade your projects today with the SNJ54147J and experience the advantages of top-notch technology at your fingertips.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides excellent durability and protection for the internal components, ensuring long-lasting performance.

Screening Level: 38535Q/M;38534H;883B

High screening levels indicate that this product has undergone rigorous testing and meets strict quality standards, ensuring reliable operation.

No. of Bits: 9

With 9 bits, this digital arithmetic circuit offers a good balance between precision and complexity for various computational tasks.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes it compatible with common circuit configurations and power sources.

Propagation Delay (tpd): 19 ns

This fast propagation delay ensures quick response times, making it suitable for time-critical applications where speed is essential.

Temperature Grade: MILITARY

Designed to withstand extreme temperatures, this product is ideal for military or harsh environment applications where temperature fluctuations occur.

Technical Specifications

Digital Arithmetic Circuits SNJ54147J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

9 TO 4 LINE PRIORITY ENCODER

Family:

TTL/H/L

JESD-30 Code:

R-CDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

70 mA

Propagation Delay (tpd):

19 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SNJ54147J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-065-0200, 5962010650200

NIIN

010650200

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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