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SNJ54181J

Texas Instruments

SNJ54181J by Texas Instruments

SNJ54181J by Texas Instruments is a 4-bit digital arithmetic circuit with TTL technology. It operates at a supply voltage of 5V and has a propagation delay of 50ns. Ideal for military applications, it features a ceramic package body, glass-sealed rectangular shape, and can withstand temperatures from -55 to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 4,052 parts In-Stock

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Digiode

USA . 1,278 parts In-Stock

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DF Sales Co.

USA . 170 parts In-Stock

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DF Sales Co.

USA . 170 parts In-Stock

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Electronic Expediters

USA . 135 parts In-Stock

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Resion

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AZTECH Wire

Italy . 820 parts In-Stock

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Parana Technologies

USA . 1,801 parts In-Stock

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$19.704

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$1,829.788

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$17.733

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DigiPath Technology Company

USA . 1,915 parts In-Stock

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$19.961

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ChromeModa Solutions

Germany . 1,546 parts In-Stock

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IDEA Electronic Components Group

UK . 678 parts In-Stock

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$19.925

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One Stop Electronics

USA . 210 parts In-Stock

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Corphita

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Overview

Discover the unmatched quality and reliability of the SNJ54181J by Texas Instruments, a top-of-the-line digital arithmetic circuit designed to exceed your expectations. Manufactured by the industry leader in electronic components, this product offers unparalleled performance and precision for a wide range of applications. From military-grade technology to its efficient power supply, every detail has been carefully crafted to deliver exceptional value and benefits to our customers. Upgrade your projects with the SNJ54181J and experience the difference today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials ensures durability and reliability in various operating conditions.

Screening Level: 38535Q/M;38534H;883B

Compliance with these screening levels ensures high quality and reliability of the product.

No. of Bits: 4

Suitable for applications requiring processing of smaller data sizes efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with common power supplies.

Load Capacitance (CL): 15 pF

Optimized for handling a specific load capacitance for efficient performance.

Propagation Delay (tpd): 50 ns

Fast propagation delay ensures quick operation and response time.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for harsh environments.

Minimum Operating Temperature: -55 °C

Operates reliably in extreme cold conditions.

Technology: TTL

Uses TTL technology known for its high speed and low power consumption.

Maximum Power Supply Current (ICC): 135 mA

Efficient power consumption with a lower maximum current draw.

Technical Specifications

Digital Arithmetic Circuits SNJ54181J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T24

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

135 mA

Propagation Delay (tpd):

50 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SNJ54181J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-118-6295, 5962011186295

NIIN

011186295

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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