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SN74AS881AFN

Texas Instruments

SN74AS881AFN by Texas Instruments

SN74AS881AFN by Texas Instruments is a 4-bit digital arithmetic circuit with a supply voltage of 5V and propagation delay of 21ns. This TTL technology chip carrier has 28 terminals, operates in commercial temperature range, and is suitable for applications requiring fast arithmetic calculations in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,732 parts In-Stock

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5,732

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Digiode

USA . 460 parts In-Stock

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460

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Distributors (Availability)

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Andel Nordic

Denmark . 2,112 parts In-Stock

1+ parts

$2.944

100+ parts

-

1k+ parts

$2.826

10k+ parts

$2.826

2,112

$2.944

-

$2.826

$2.826

AZTECH Wire

Italy . 826 parts In-Stock

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$6.103

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826

$6.103

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Parana Technologies

USA . 1,888 parts In-Stock

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$15.304

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$15.696

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1,888

$15.304

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$15.696

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IDEA Electronic Components Group

UK . 1,520 parts In-Stock

1+ parts

$17.195

100+ parts

$16.335

1k+ parts

$15.476

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1,520

$17.195

$16.335

$15.476

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ChromeModa Solutions

Germany . 1,187 parts In-Stock

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$17.195

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$14.100

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1,187

$17.195

$14.100

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One Stop Electronics

USA . 941 parts In-Stock

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$34.000

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941

$34.000

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DigiPath Technology Company

USA . 712 parts In-Stock

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$15.503

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712

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$15.503

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Corphita

USA . 463 parts In-Stock

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463

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Overview

Upgrade your digital arithmetic circuits with the SN74AS881AFN by Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments delivers reliable solutions for various applications in the electronics industry. This 4-bit chip carrier boasts a nominal supply voltage of 5V and a propagation delay of just 21 ns, ensuring optimal performance. With its small form factor and commercial-grade temperature tolerance, this product provides value and efficiency to customers looking for high-quality digital arithmetic circuits. Experience the benefits of Texas Instruments' cutting-edge technology with the SN74AS881AFN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and simplifying assembly.

No. of Bits: 4

Suitable for applications requiring operations on 4-bit binary numbers.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard voltage of 5V, making it compatible with most systems.

Propagation Delay (tpd): 21 ns

Low propagation delay ensures fast operation of arithmetic circuits.

Technology: TTL

Utilizes TTL technology known for its reliable and robust performance in digital circuits.

Maximum Power Supply Current (ICC): 210 mA

Can handle a maximum current of 210 mA, ensuring stable and efficient power delivery.

Technical Specifications

Digital Arithmetic Circuits SN74AS881AFN attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD

Family:

AS

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

210 mA

Propagation Delay (tpd):

21 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.5062 mm

Trade Compliance

SN74AS881AFN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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