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SN74LS385DWR

Texas Instruments

SN74LS385DWR by Texas Instruments

SN74LS385DWR by Texas Instruments is a digital arithmetic circuit with 4 functions, operating at a supply voltage range of 4.75V to 5.25V. It has a propagation delay of 27ns and can handle load capacitance up to 15pF. This small outline package is ideal for commercial applications requiring fast signal processing in the temperature range of 0°C to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,703 parts In-Stock

1+ parts

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7,703

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Digiode

USA . 2,915 parts In-Stock

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2,915

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,950 parts In-Stock

1+ parts

$8.233

100+ parts

-

1k+ parts

$7.904

10k+ parts

$7.904

1,950

$8.233

-

$7.904

$7.904

AZTECH Wire

Italy . 780 parts In-Stock

1+ parts

$13.204

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780

$13.204

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Parana Technologies

USA . 985 parts In-Stock

1+ parts

$26.558

100+ parts

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$27.127

10k+ parts

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985

$26.558

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$27.127

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DigiPath Technology Company

USA . 886 parts In-Stock

1+ parts

$29.244

100+ parts

$26.905

1k+ parts

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886

$29.244

$26.905

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ChromeModa Solutions

Germany . 251 parts In-Stock

1+ parts

$29.841

100+ parts

$24.470

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251

$29.841

$24.470

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IDEA Electronic Components Group

UK . 92 parts In-Stock

1+ parts

$29.841

100+ parts

$28.349

1k+ parts

$26.857

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92

$29.841

$28.349

$26.857

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One Stop Electronics

USA . 1,608 parts In-Stock

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$38.000

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1,608

$38.000

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Corphita

USA . 4,169 parts In-Stock

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4,169

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Overview

Enhance your digital arithmetic circuits with the SN74LS385DWR by Texas Instruments. Known for their quality and reliability, Texas Instruments delivers a product that exceeds expectations. Designed for applications requiring precise calculations, this versatile component offers customers exceptional value with its high performance and efficiency. Upgrade your electronic projects with the SN74LS385DWR and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective, durable, and provides good protection for the circuit components inside.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the circuit, making it suitable for automated mass production.

No. of Functions: 4

Having multiple functions packed into one component can save space on the circuit board and reduce overall system complexity.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at the standard voltage level, ensuring compatibility with most existing systems.

Load Capacitance (CL): 15 pF

Low load capacitance minimizes power consumption and signal distortion, leading to better performance.

No. of Terminals: 20

Having a higher number of terminals allows for more connectivity options and flexibility in circuit design.

Propagation Delay (tpd): 27 ns

A low propagation delay enables fast signal processing and reduces latency in the circuit.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: 0 °C

Can operate effectively in a wide range of temperatures, making it versatile for various applications.

Terminal Position: DUAL

Dual terminal positions provide additional stability and support for the component when mounted on the circuit board.

Maximum Seated Height: 2.65 mm

Low profile design helps in space-constrained applications and allows for compact system layouts.

Width: 7.5 mm

Narrow width saves board space and facilitates dense packing of components for higher integration.

Minimum Supply Voltage (Vsup): 4.75 V

Operating at a low minimum supply voltage allows for efficient power usage and extends battery life for portable devices.

Length: 12.8 mm

Compact length contributes to overall space efficiency and easy integration into various system designs.

Temperature Grade: COMMERCIAL

Built to commercial grade standards ensures reliable performance in typical operating environments.

Technology: TTL

TTL technology offers a good balance between speed, power consumption, and noise immunity, making it suitable for many applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering during assembly, increasing reliability.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for easy interfacing with other components and simplifies manufacturing processes.

Maximum Supply Voltage (Vsup): 5.25 V

Operating within a safe maximum supply voltage range ensures component longevity and reliability.

Maximum Power Supply Current (ICC): 75 mA

Capable of handling higher power supply currents without overheating, which is crucial for stable operation.

Technical Specifications

Digital Arithmetic Circuits SN74LS385DWR attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

SERIAL ADDER/SUBTRACTOR

Family:

LS

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

75 mA

Propagation Delay (tpd):

27 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN74LS385DWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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