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SNJ54HC882JT

Texas Instruments

SNJ54HC882JT by Texas Instruments

SNJ54HC882JT by Texas Instruments is a CMOS digital arithmetic circuit with 24 terminals in a ceramic rectangular package. It operates b/w -55°C to 125°C, suitable for military-grade applications. The screening level is 38535Q/M;38534H;883B, making it ideal for high-reliability environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,815 parts In-Stock

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4,815

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Vyrian

USA . 3,836 parts In-Stock

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3,836

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Distributors (Availability)

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AZTECH Wire

Italy . 558 parts In-Stock

1+ parts

$6.600

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558

$6.600

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One Stop Electronics

USA . 1,092 parts In-Stock

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$17.000

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1,092

$17.000

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Parana Technologies

USA . 430 parts In-Stock

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$17.682

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$17.870

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430

$17.682

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$17.870

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DigiPath Technology Company

USA . 1,389 parts In-Stock

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$19.470

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1,389

$19.470

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ChromeModa Solutions

Germany . 5,028 parts In-Stock

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$19.867

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$16.291

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5,028

$19.867

$16.291

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IDEA Electronic Components Group

UK . 464 parts In-Stock

1+ parts

$19.867

100+ parts

$18.874

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$17.880

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464

$19.867

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$17.880

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Corphita

USA . 1,686 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the SNJ54HC882JT digital arithmetic circuit. This versatile component is perfect for a wide range of applications, offering exceptional performance and durability. With Texas Instruments' reputation for excellence, you can trust that this product will exceed your expectations. Add value to your projects with the SNJ54HC882JT and enjoy the benefits of top-notch technology and innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and high temperature resistance, making it ideal for military grade applications.

Screening Level: 38535Q/M;38534H;883B

Compliance with multiple screening levels ensures high reliability and performance stability in demanding environments.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into circuit designs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in extreme conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures functionality even in very cold environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the circuit energy-efficient and reliable.

Technical Specifications

Digital Arithmetic Circuits SNJ54HC882JT attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNJ54HC882JT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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