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SN74AS181ANTP1

Texas Instruments

SN74AS181ANTP1 by Texas Instruments

SN74AS181ANTP1 by Texas Instruments is a TTL digital arithmetic circuit with 24 terminals in an IN-LINE package. It operates b/w 0-70°C, suitable for commercial applications requiring precise calculations and logic operations. The rectangular plastic/epoxy body ensures durability and reliability in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,188 parts In-Stock

1+ parts

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4,188

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Digiode

USA . 4,004 parts In-Stock

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4,004

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,132 parts In-Stock

1+ parts

$6.950

100+ parts

-

1k+ parts

$6.672

10k+ parts

$6.672

3,132

$6.950

-

$6.672

$6.672

Parana Technologies

USA . 1,956 parts In-Stock

1+ parts

$14.217

100+ parts

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1k+ parts

$14.670

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1,956

$14.217

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$14.670

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DigiPath Technology Company

USA . 583 parts In-Stock

1+ parts

$15.655

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583

$15.655

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ChromeModa Solutions

Germany . 4,979 parts In-Stock

1+ parts

$15.974

100+ parts

$13.099

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4,979

$15.974

$13.099

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IDEA Electronic Components Group

UK . 586 parts In-Stock

1+ parts

$15.974

100+ parts

$15.175

1k+ parts

$14.377

10k+ parts

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586

$15.974

$15.175

$14.377

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AZTECH Wire

Italy . 453 parts In-Stock

1+ parts

$16.527

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453

$16.527

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One Stop Electronics

USA . 1,044 parts In-Stock

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$26.000

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1,044

$26.000

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Corphita

USA . 1,562 parts In-Stock

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1,562

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Overview

Unlock the potential of your digital arithmetic circuits with the Texas Instruments SN74AS181ANTP1. Manufactured by a leader in the industry, this product boasts top-notch quality and reliability. Ideal for a wide range of applications, this component offers unparalleled value with its innovative technology and commercial-grade performance. Say goodbye to limitations and hello to seamless operations with the SN74AS181ANTP1 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various operating conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and integration into electronic systems, saving space and facilitating easy assembly.

No. of Terminals: 24

With 24 terminals, this product offers a sufficient number of connection points for complex circuit designs and connectivity requirements.

Package Style (Meter): IN-LINE

The in-line package style enables easy integration into existing circuits and systems, providing a seamless connection for efficient operation.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance in demanding environments and under varying temperature conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in colder environments without compromising performance, enhancing versatility.

Terminal Position: DUAL

The dual terminal position provides flexibility in connectivity options, allowing for different circuit configurations and integration possibilities.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates suitability for standard commercial applications, ensuring compatibility with a wide range of electronic systems.

Technology: TTL

Utilizing TTL technology ensures fast and reliable digital arithmetic operations, making it ideal for precision calculations and data processing tasks.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process and provides secure connections, enhancing the overall durability and reliability of the product.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy soldering and connection with standard electronic components, facilitating compatibility and integration in various circuit designs.

Technical Specifications

Digital Arithmetic Circuits SN74AS181ANTP1 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS181ANTP1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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