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CD74ACT283M96

Texas Instruments

CD74ACT283M96 by Texas Instruments

CD74ACT283M96 by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 18.2 ns, operating at a supply voltage of 5V. This CMOS technology chip has a temperature range from -55 to 125 °C and is ideal for military-grade applications requiring fast arithmetic calculations in compact spaces.

Median Price

$0.270

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

$0.270

100+ parts

$0.260

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$0.260

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2,500

$0.270

$0.260

$0.260

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Distributors (In-Stock)

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Digiode

USA . 2,070 parts In-Stock

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$0.303

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$0.303

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Vyrian

USA . 985 parts In-Stock

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$0.319

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985

$0.319

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DigiKey Marketplace

USA . 2,500 parts In-Stock

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Corphita

USA . 694 parts In-Stock

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$0.287

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Native Components

USA . 71 parts In-Stock

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$7.030

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71

$7.030

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Andel Nordic

Denmark . 2,869 parts In-Stock

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$10.828

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$10.394

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$10.394

2,869

$10.828

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$10.394

$10.394

Parana Technologies

USA . 1,033 parts In-Stock

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$27.411

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$35.536

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1,033

$27.411

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DigiPath Technology Company

USA . 992 parts In-Stock

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$30.183

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$27.768

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992

$30.183

$27.768

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ChromeModa Solutions

Germany . 2,543 parts In-Stock

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$30.799

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$25.255

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IDEA Electronic Components Group

UK . 698 parts In-Stock

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$30.799

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$29.259

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$27.719

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698

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$27.719

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QUARKTWIN TECHNOLOGY LTD

USA . 11,089 parts In-Stock

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Microchip USA

USA . 3,126 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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Supply Digital

USA . 2,644 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,000 parts In-Stock

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Northwest PG Solutions

USA . 1,493 parts In-Stock

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$6.889

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1,493

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$6.889

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Overview

Unlock the power of precise digital arithmetic with the CD74ACT283M96 by Texas Instruments. Crafted with top-quality materials and cutting-edge technology, this 4-bit arithmetic circuit offers unparalleled performance and reliability. Ideal for military-grade applications, this compact device boasts a quick propagation delay of 18.2 ns, ensuring efficient operation even in demanding environments. Trust Texas Instruments to deliver superior products that exceed expectations. Embrace innovation and efficiency with the CD74ACT283M96, and experience next-level performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the circuit, ensuring a longer lifespan.

No. of Bits: 4

Suitable for applications that require limited bit processing, making it cost-effective for specific uses.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage ensures consistent performance of the circuit under normal operating conditions.

Propagation Delay (tpd): 18.2 ns

Low propagation delay allows for fast operation and efficient processing of digital signals.

Minimum Operating Temperature: -55 °C

Wide temperature range makes it suitable for use in harsh environments or extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it efficient for digital circuit applications.

Technical Specifications

Digital Arithmetic Circuits CD74ACT283M96 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD

Family:

ACT

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

18.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74ACT283M96 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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