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7802701FX

Texas Instruments

7802701FX by Texas Instruments

7802701FX by Texas Instruments is an 8-bit digital arithmetic circuit with a propagation delay of 36ns. It operates in a temperature range from -55°C to 125°C, making it suitable for military applications. This surface-mount device has a package style of flatpack and requires a nominal voltage of 5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,582 parts In-Stock

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3,582

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Digiode

USA . 408 parts In-Stock

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408

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Distributors (Availability)

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Andel Nordic

Denmark . 1,388 parts In-Stock

1+ parts

$3.430

100+ parts

-

1k+ parts

$3.293

10k+ parts

$3.293

1,388

$3.430

-

$3.293

$3.293

Native Components

USA . 477 parts In-Stock

1+ parts

$10.193

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477

$10.193

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Northwest PG Solutions

USA . 192 parts In-Stock

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$11.212

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$10.091

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192

$11.212

$10.091

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AZTECH Wire

Italy . 626 parts In-Stock

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$13.174

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626

$13.174

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Parana Technologies

USA . 525 parts In-Stock

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$22.664

100+ parts

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$23.322

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525

$22.664

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$23.322

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ChromeModa Solutions

Germany . 2,927 parts In-Stock

1+ parts

$25.465

100+ parts

$20.881

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2,927

$25.465

$20.881

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IDEA Electronic Components Group

UK . 2,261 parts In-Stock

1+ parts

$25.465

100+ parts

$24.192

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$22.918

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2,261

$25.465

$24.192

$22.918

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One Stop Electronics

USA . 1,007 parts In-Stock

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$51.000

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1,007

$51.000

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DigiPath Technology Company

USA . 1,524 parts In-Stock

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$22.959

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1,524

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$22.959

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Corphita

USA . 340 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the 7802701FX by Texas Instruments, a top-tier manufacturer of digital arithmetic circuits. This high-quality product offers unparalleled precision and reliability in a variety of applications. With a MILITARY-grade screening level and a MILITARY temperature grade, this versatile component ensures optimal performance even in the most demanding conditions. Elevate your projects with the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection to the circuit, making it suitable for harsh operating environments.

No. of Bits: 8

Having 8 bits allows for a wide range of arithmetic operations to be performed, making the circuit versatile for different applications.

Nominal Supply Voltage: 5V

A stable and common supply voltage ensures consistent and reliable performance of the circuit.

Technology: TTL

TTL technology offers high speed and low power consumption, making the circuit efficient for arithmetic calculations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the circuit to function in a wide range of environmental conditions.

Technical Specifications

Digital Arithmetic Circuits 7802701FX attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDFP-F16

Length:

10.2 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT APPLICABLE

Propagation Delay (tpd):

36 ns

Qualification:

Qualified

Screening Level:

MIL-M-38510

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT APPLICABLE

Width:

6.73 mm

Trade Compliance

7802701FX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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