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SNJ54LS275J

Texas Instruments

SNJ54LS275J by Texas Instruments

SNJ54LS275J by Texas Instruments is a TTL digital arithmetic circuit with 16 terminals in an IN-LINE package. It operates b/w -55°C to 125°C, making it suitable for military-grade applications. The CERAMIC package body material ensures durability and reliability in harsh environments.

Median Price

$9.820

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21 parts In-Stock

1+ parts

-

100+ parts

$9.820

1k+ parts

$8.790

10k+ parts

$8.270

21

-

$9.820

$8.790

$8.270

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,406 parts In-Stock

1+ parts

$10.374

100+ parts

-

1k+ parts

-

10k+ parts

-

2,406

$10.374

-

-

-

Vyrian

USA . 6,966 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,966

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,118 parts In-Stock

1+ parts

$7.623

100+ parts

-

1k+ parts

$7.318

10k+ parts

$7.318

2,118

$7.623

-

$7.318

$7.318

Corphita

USA . 2,404 parts In-Stock

1+ parts

$9.828

100+ parts

-

1k+ parts

-

10k+ parts

-

2,404

$9.828

-

-

-

Parana Technologies

USA . 148 parts In-Stock

1+ parts

$27.990

100+ parts

-

1k+ parts

$42.534

10k+ parts

-

148

$27.990

-

$42.534

-

DigiPath Technology Company

USA . 396 parts In-Stock

1+ parts

$30.821

100+ parts

-

1k+ parts

-

10k+ parts

-

396

$30.821

-

-

-

ChromeModa Solutions

Germany . 4,344 parts In-Stock

1+ parts

$31.450

100+ parts

$25.789

1k+ parts

-

10k+ parts

-

4,344

$31.450

$25.789

-

-

IDEA Electronic Components Group

UK . 1,813 parts In-Stock

1+ parts

$31.450

100+ parts

$29.878

1k+ parts

$28.305

10k+ parts

-

1,813

$31.450

$29.878

$28.305

-

Overview

Upgrade your digital arithmetic circuits with the high-quality SNJ54LS275J by Texas Instruments. Manufactured with precision and reliability in mind, this versatile component offers a wide range of applications in various industries. From military-grade technology to its durable ceramic package body material, this product ensures optimal performance in extreme temperatures. Experience seamless integration and enhanced efficiency with the SNJ54LS275J, providing value and benefits that exceed expectations. Elevate your projects with Texas Instruments' trusted expertise and innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity, ensuring efficient heat dissipation and overall product durability.

Screening Level: 38535Q/M;38534H;883B

This high screening level ensures reliability and performance consistency in demanding military applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easier integration into circuit designs and efficient use of space.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in harsh environments without risking damage.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures functionality even in extremely cold conditions.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures robust performance in a wide range of temperature conditions typically encountered in military applications.

Technology: TTL

TTL technology provides fast and reliable digital signal processing capabilities, making the product suitable for high-speed arithmetic circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, making the product suitable for rugged military applications where reliability is critical.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration into existing circuit boards and facilitates efficient soldering processes.

Technical Specifications

Digital Arithmetic Circuits SNJ54LS275J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNJ54LS275J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-162-0246, 5962011620246

NIIN

011620246

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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