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TPC4582AN

Texas Instruments

TPC4582AN by Texas Instruments

TPC4582AN by Texas Instruments is a CMOS digital arithmetic circuit with 16 terminals in an industrial-grade rectangular package. It operates b/w -40°C to 85°C, making it suitable for various applications requiring precise calculations and data processing in harsh environments. The through-hole terminal form and 2.54mm pitch enhance its reliability in demanding industrial settings.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,078 parts In-Stock

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Digiode

USA . 371 parts In-Stock

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371

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Distributors (Availability)

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Parana Technologies

USA . 2,071 parts In-Stock

1+ parts

$16.017

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$16.360

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2,071

$16.017

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$16.360

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DigiPath Technology Company

USA . 330 parts In-Stock

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$17.637

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330

$17.637

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ChromeModa Solutions

Germany . 5,151 parts In-Stock

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$17.997

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$14.758

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$17.997

$14.758

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IDEA Electronic Components Group

UK . 1,818 parts In-Stock

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$17.997

100+ parts

$17.097

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$16.197

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1,818

$17.997

$17.097

$16.197

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One Stop Electronics

USA . 1,068 parts In-Stock

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$18.000

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1,068

$18.000

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AZTECH Wire

Italy . 411 parts In-Stock

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$19.131

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Corphita

USA . 2,414 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the TPC4582AN by Texas Instruments. Known for producing high-quality components, Texas Instruments delivers reliable solutions for a wide range of applications. With its durable plastic/epoxy package and industrial temperature grade, this product ensures optimal performance in any environment. The TPC4582AN's 16 terminals and CMOS technology make it versatile for various projects. Trust in Texas Instruments to provide the quality and value you need for your next digital arithmetic circuit design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into existing circuit designs.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting to other components and allows for complex circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to incorporate into existing circuit layouts, saving space and facilitating efficient wiring.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in a wide range of environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to operate in cold environments without risk of malfunctions.

Terminal Position: DUAL

The dual terminal position provides redundancy and ensures a secure connection for reliable performance.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades means the product can withstand harsh conditions and maintain stability in demanding environments.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in digital circuit applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for easy soldering and secure connections, ensuring stability in the circuit.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch provides sufficient spacing for easy connections and reduces the risk of short circuits in the circuit design.

Technical Specifications

Digital Arithmetic Circuits TPC4582AN attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TPC4582AN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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