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SN54HC381J

Texas Instruments

SN54HC381J by Texas Instruments

SN54HC381J by Texas Instruments is a CMOS digital arithmetic circuit with 20 terminals in an IN-LINE package. It operates b/w -55°C to 125°C, making it suitable for military-grade applications. The package body material is ceramic, and the terminal form is through-hole, with a terminal pitch of 2.54mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,324 parts In-Stock

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Digiode

USA . 2,453 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 554 parts In-Stock

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$5.974

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$5.736

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$5.736

554

$5.974

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$5.736

$5.736

Parana Technologies

USA . 1,308 parts In-Stock

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$11.010

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$11.472

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$11.010

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DigiPath Technology Company

USA . 539 parts In-Stock

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$12.124

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$11.154

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539

$12.124

$11.154

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ChromeModa Solutions

Germany . 3,006 parts In-Stock

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$12.371

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$10.144

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3,006

$12.371

$10.144

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IDEA Electronic Components Group

UK . 1,937 parts In-Stock

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$12.371

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$11.752

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$11.134

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1,937

$12.371

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$11.134

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AZTECH Wire

Italy . 897 parts In-Stock

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$15.599

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One Stop Electronics

USA . 1,419 parts In-Stock

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$18.000

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Corphita

USA . 3,986 parts In-Stock

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Overview

Unlock the power of digital arithmetic circuits with the SN54HC381J from Texas Instruments. Known for their high-quality components, Texas Instruments delivers reliable solutions for a wide range of applications. This versatile product offers customers unmatched value and benefits, making it the perfect choice for any project requiring precision and efficiency. Whether you're designing complex mathematical algorithms or building advanced computing systems, the SN54HC381J is sure to exceed your expectations. Trust Texas Instruments for superior performance and reliability in every application.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and electrical insulation, enhancing the reliability and performance of the product.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient and compact placement in circuits, optimizing space usage.

No. of Terminals: 20

Having 20 terminals allows for connectivity to multiple components, increasing the versatility and functionality of the product.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand demanding conditions without compromising performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments, making it suitable for a wide range of applications.

Terminal Position: DUAL

Dual terminal position provides redundancy and enhances reliability in case of one terminal failure.

Temperature Grade: MILITARY

Military-grade temperature rating indicates high durability and resilience to harsh environmental conditions, making it ideal for rugged applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various digital systems, ensuring efficient and reliable performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals are robust and provide secure connections, reducing the risk of disconnection or damage during operation.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm allows for easy and convenient integration with other components on a circuit board, facilitating assembly and maintenance.

Technical Specifications

Digital Arithmetic Circuits SN54HC381J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN54HC381J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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