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5962-8688101RA

Texas Instruments

5962-8688101RA by Texas Instruments

The Texas Instruments 5962-8688101RA is a MIL-STD-883 compliant digital arithmetic circuit with 4 bits, operating at a supply voltage range of 4.5V to 5.5V. Featuring a propagation delay of 59ns, it is designed for military-grade applications requiring TTL technology and an operating temperature range from -55°C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,466 parts In-Stock

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Vyrian

USA . 2,342 parts In-Stock

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North Shore Components

USA . 30 parts In-Stock

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Q Components

USA . 22 parts In-Stock

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Electronic Expediters

USA . 2 parts In-Stock

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Andel Nordic

Denmark . 334 parts In-Stock

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$2.273

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$2.182

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$2.182

334

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$2.182

AZTECH Wire

Italy . 229 parts In-Stock

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$16.548

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Parana Technologies

USA . 1,921 parts In-Stock

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$19.815

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$1,840.120

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$17.833

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DigiPath Technology Company

USA . 533 parts In-Stock

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$21.819

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$20.073

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ChromeModa Solutions

Germany . 3,630 parts In-Stock

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$22.264

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$18.256

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IDEA Electronic Components Group

UK . 1,407 parts In-Stock

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$22.264

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$21.151

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$20.038

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One Stop Electronics

USA . 1,229 parts In-Stock

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Corphita

USA . 4,577 parts In-Stock

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Northwest PG Solutions

USA . 1,920 parts In-Stock

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Native Components

USA . 691 parts In-Stock

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Overview

Upgrade your digital arithmetic circuits with the 5962-8688101RA from Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments offers a MIL-STD-883 screening level product that guarantees superior performance. With a nominal supply voltage of 5V and a propagation delay of just 59ns, this product is perfect for military-grade applications where precision and efficiency are crucial. Trust Texas Instruments to deliver exceptional value and unmatched benefits to meet all your circuit needs.

Feature Benefit Bullets

Screening Level: MIL-STD-883

Ensures high reliability and quality standards for military applications.

Package Shape: RECTANGULAR

Provides a standard shape for easy integration into various systems.

No. of Bits: 4

Suitable for simpler arithmetic calculations and basic digital operations.

Nominal Supply Voltage / Vsup (V): 5

Stable voltage supply for consistent and reliable performance.

No. of Terminals: 20

Adequate number of terminals for connectivity with other components.

Package Style (Meter): IN-LINE

Space-efficient design for compact circuit layouts.

Propagation Delay (tpd): 59 ns

Fast processing speed for efficient arithmetic operations.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments without performance degradation.

Minimum Operating Temperature: -55 °C

Operational in extreme cold conditions without issues.

Terminal Finish: TIN LEAD

Provides good conductivity and solderability for stable connections.

Terminal Position: DUAL

Allows for flexibility in component orientation during installation.

Minimum Supply Voltage (Vsup): 4.5 V

Can operate at lower voltages for energy efficiency.

Temperature Grade: MILITARY

Meets stringent military grade standards for durability and performance.

Technology: TTL

Utilizes Transistor-Transistor Logic for reliable digital signal processing.

Terminal Form: THROUGH-HOLE

Facilitates easy insertion and soldering onto circuit boards.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle higher voltage inputs for flexibility in power supply options.

Technical Specifications

Digital Arithmetic Circuits 5962-8688101RA attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS

Family:

LS

JESD-30 Code:

R-XDIP-T20

JESD-609 Code:

e0

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

59 ns

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

5962-8688101RA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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