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5962-86881012A

Texas Instruments

5962-86881012A by Texas Instruments

Texas Instruments' 5962-86881012A is a digital arithmetic circuit with 4 bits, 59ns propagation delay, and TTL technology. It operates in military-grade temperatures from -55°C to 125°C, ideal for applications requiring fast calculations in harsh environments. The chip carrier package with 20 terminals supports surface mount assembly for reliable performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,150 parts In-Stock

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Digiode

USA . 747 parts In-Stock

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Andel Nordic

Denmark . 36 parts In-Stock

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$2.649

100+ parts

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$2.543

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$2.543

36

$2.649

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$2.543

$2.543

AZTECH Wire

Italy . 838 parts In-Stock

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$6.331

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838

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Native Components

USA . 71 parts In-Stock

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$7.830

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Northwest PG Solutions

USA . 1,314 parts In-Stock

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$8.613

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$7.752

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Parana Technologies

USA . 2,094 parts In-Stock

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$20.741

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$20.878

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$20.741

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DigiPath Technology Company

USA . 1,039 parts In-Stock

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$22.838

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$21.011

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ChromeModa Solutions

Germany . 4,521 parts In-Stock

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$23.304

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$19.109

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IDEA Electronic Components Group

UK . 345 parts In-Stock

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$23.304

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$22.139

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$20.974

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One Stop Electronics

USA . 1,216 parts In-Stock

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$59.000

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Corphita

USA . 2,124 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the 5962-86881012A by Texas Instruments, a leading manufacturer in digital arithmetic circuits. This versatile product is ideal for a wide range of applications, offering customers exceptional value and benefits. Whether you need precision in military-grade equipment or efficient data processing in industrial machinery, this chip carrier package with 4 bits and 20 terminals delivers superior performance with a fast propagation delay of 59 ns. Trust Texas Instruments to provide cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Surface Mount: YES

Convenient for easy and secure attachment to circuit boards, allows for efficient assembly.

Screening Level: MIL-STD-883

Meets stringent military standards for reliability, ensuring high performance in harsh environments.

Package Shape: SQUARE

Space-efficient design, allows for compact integration into circuits.

No. of Bits: 4

Suitable for applications requiring processing of 4-bit data.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supply, widely available and easy to implement.

No. of Terminals: 20

Provides ample connectivity options for interfacing with other circuit components.

Package Style (Meter): CHIP CARRIER

Protects the internal circuitry and facilitates efficient heat dissipation.

Propagation Delay (tpd): 59 ns

Fast processing speed, suitable for applications requiring quick calculations.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for demanding operating conditions.

Minimum Operating Temperature: -55 °C

Operational in very cold environments, provides versatility in usage.

Terminal Finish: TIN LEAD

Resistant to corrosion, ensures long-term reliability of connections.

Terminal Position: QUAD

Allows for easy alignment during installation, reduces chances of errors in connection.

Minimum Supply Voltage (Vsup): 4.5 V

Operates at lower voltages, conserving power and increasing efficiency.

Temperature Grade: MILITARY

Built to withstand extreme temperature variations and harsh conditions, suitable for military applications.

Technology: TTL

Uses transistor-transistor logic for reliable and efficient signal processing.

Terminal Form: NO LEAD

Reduces chances of lead contamination, environmentally friendly design.

Maximum Supply Voltage (Vsup): 5.5 V

Operating range up to 5.5V provides flexibility in power supply options.

Technical Specifications

Digital Arithmetic Circuits 5962-86881012A attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS

Family:

LS

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e0

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

59 ns

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

5962-86881012A Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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