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SN74S381J

Texas Instruments

SN74S381J by Texas Instruments

SN74S381J by Texas Instruments is a 4-bit digital arithmetic circuit with a nominal voltage of 5V and propagation delay of 25ns. It features a ceramic, glass-sealed rectangular package with 20 terminals in an in-line style. Ideal for commercial applications requiring precise arithmetic calculations within the temperature range of 0 to 70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,700 parts In-Stock

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Digiode

USA . 3,079 parts In-Stock

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Electronic Expediters

USA . 217 parts In-Stock

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ECAB

Sweden . 60 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 53 parts In-Stock

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Beltway Electronics Company

USA . 35 parts In-Stock

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Prism Electronics

USA . 10 parts In-Stock

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Q Components

USA . 10 parts In-Stock

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Andel Nordic

Denmark . 3,986 parts In-Stock

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$5.777

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$5.546

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$5.546

3,986

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$5.546

AZTECH Wire

Italy . 731 parts In-Stock

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$6.228

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731

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Parana Technologies

USA . 1,871 parts In-Stock

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$19.393

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$19.407

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DigiPath Technology Company

USA . 1,026 parts In-Stock

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$21.354

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IDEA Electronic Components Group

UK . 352 parts In-Stock

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$21.790

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$20.700

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$19.611

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ChromeModa Solutions

Germany . 331 parts In-Stock

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$21.790

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$17.868

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One Stop Electronics

USA . 300 parts In-Stock

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$39.000

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Corphita

USA . 4,142 parts In-Stock

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Assy Fe

Spain . 84 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the top-notch quality of the SN74S381J by Texas Instruments. Crafted with precision and reliability in mind, this ceramic, glass-sealed rectangular package offers seamless performance for various applications. With a nominal supply voltage of 5V and a propagation delay of just 25ns, this innovative product ensures efficiency and accuracy in your projects. Trust Texas Instruments to deliver unmatched value and benefits with the SN74S381J, providing customers with a competitive edge in the world of digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed packaging provides durability and protection for the circuit, ensuring long-term reliability.

No. of Bits: 4

With 4 bits, this circuit can perform computations and calculations accurately and efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, making it compatible with a wide range of systems and applications.

Propagation Delay (tpd): 25 ns

Fast propagation delay of 25ns allows for quick data processing and response times.

Technology: TTL

Utilizing TTL technology ensures high-speed performance and reliability in digital arithmetic operations.

Technical Specifications

Digital Arithmetic Circuits SN74S381J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD

Family:

S

JESD-30 Code:

R-GDIP-T20

Length:

24.195 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

160 mA

Propagation Delay (tpd):

25 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN74S381J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-128-2032, 5962011282032, 5962-01-040-8988, 5962010408988

NIIN

011282032, 010408988

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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