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SN54HC679FK

Texas Instruments

SN54HC679FK by Texas Instruments

SN54HC679FK by Texas Instruments is a CMOS digital arithmetic circuit in a ceramic chip carrier package. With 20 terminals and operating temperatures ranging from -55°C to 125°C, it is ideal for military-grade applications requiring high temperature tolerance. This surface-mountable square-shaped chip is designed for precise calculations in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,782 parts In-Stock

1+ parts

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4,782

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Vyrian

USA . 3,473 parts In-Stock

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3,473

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Distributors (Availability)

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Andel Nordic

Denmark . 3,210 parts In-Stock

1+ parts

$8.216

100+ parts

-

1k+ parts

$7.888

10k+ parts

$7.888

3,210

$8.216

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$7.888

$7.888

AZTECH Wire

Italy . 462 parts In-Stock

1+ parts

$15.705

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462

$15.705

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Parana Technologies

USA . 1,722 parts In-Stock

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$21.833

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$22.320

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1,722

$21.833

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$22.320

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DigiPath Technology Company

USA . 1,290 parts In-Stock

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$24.041

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1,290

$24.041

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ChromeModa Solutions

Germany . 4,938 parts In-Stock

1+ parts

$24.532

100+ parts

$20.116

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4,938

$24.532

$20.116

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IDEA Electronic Components Group

UK . 1,097 parts In-Stock

1+ parts

$24.532

100+ parts

$23.305

1k+ parts

$22.079

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1,097

$24.532

$23.305

$22.079

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One Stop Electronics

USA . 983 parts In-Stock

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$29.000

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983

$29.000

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Corphita

USA . 1,598 parts In-Stock

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1,598

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Overview

Enhance your digital arithmetic circuits with the SN54HC679FK by Texas Instruments. With a reputation for quality and reliability, Texas Instruments delivers cutting-edge technology in a compact chip carrier package. Ideal for military-grade applications, this ceramic surface-mount device offers superior performance in extreme temperatures. Experience seamless integration and enhanced efficiency with the SN54HC679FK, designed to exceed your expectations. Elevate your projects with the best in class digital arithmetic circuits from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a highly durable material that helps protect the circuits from damage and provides good heat dissipation, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on printed circuit boards, making this product suitable for automated manufacturing processes.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the PCB, maximizing component density and reducing overall size of the circuit.

No. of Terminals: 20

With 20 terminals, this product offers flexibility in connectivity options and can support complex digital arithmetic operations effectively.

Package Style (Meter): CHIP CARRIER

Chip carrier packages provide protection and support for the integrated circuits within, ensuring reliability and ease of handling during assembly and operation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows this product to operate in demanding environments without the risk of performance degradation or failure.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature range enables this product to function reliably in extreme cold conditions, expanding its usability in various applications.

Terminal Position: QUAD

The quad terminal configuration simplifies the connection process and enhances the stability of the connections, ensuring reliable performance in diverse operating conditions.

Temperature Grade: MILITARY

Military-grade temperature rating signifies superior quality, durability, and resilience, making this product ideal for critical applications where reliability is paramount.

Technology: CMOS

Complementary metal-oxide-semiconductor technology offers low power consumption, high speed, and compatibility with a wide range of digital systems, making this product energy-efficient and versatile.

Terminal Form: NO LEAD

No lead terminals reduce the risk of solder joint failure, enhance electrical conductivity, and simplify the manufacturing process, contributing to the overall reliability and performance of the product.

Terminal Pitch: 1.27 mm

The tight terminal pitch allows for high-density mounting on the PCB, enabling compact circuit designs and efficient use of board space, which is crucial for miniaturized electronic devices.

Technical Specifications

Digital Arithmetic Circuits SN54HC679FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN54HC679FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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