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CD74HC85PWTE4

Texas Instruments

CD74HC85PWTE4 by Texas Instruments

CD74HC85PWTE4 by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 42ns. It operates at a nominal voltage of 4.5V and has a max power supply current of 0.08mA. This CMOS technology device is ideal for military-grade applications requiring fast arithmetic calculations in compact spaces.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 7,047 parts In-Stock

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 391 parts In-Stock

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$8.833

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One Stop Electronics

USA . 1,329 parts In-Stock

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Parana Technologies

USA . 1,587 parts In-Stock

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DigiPath Technology Company

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IDEA Electronic Components Group

UK . 2,127 parts In-Stock

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$27.551

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$26.101

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ChromeModa Solutions

Germany . 1,506 parts In-Stock

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Ampacity Inc.

Singapore . 520 parts In-Stock

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Component Stockers USA

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Corphita

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Microchip USA

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Perfect Parts

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Andel Nordic

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Overview

Unlock the power of precision with the CD74HC85PWTE4 from Texas Instruments, a top-tier manufacturer known for delivering exceptional quality in the field of Digital Arithmetic Circuits. This versatile product offers a seamless solution for various applications, ensuring reliable performance and efficient operation. With a compact design and advanced technology, this component boasts unparalleled value and benefits for customers seeking superior functionality and seamless integration. Elevate your projects with the CD74HC85PWTE4 and experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Propagation Delay At Nominal Supply: 42 ns

Low propagation delay ensures quick response times in arithmetic calculations.

Surface Mount: YES

Ease of installation and space-saving design with surface mount capability.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on circuit boards.

No. of Bits: 4

Suitable for processing small to medium-sized arithmetic operations efficiently.

Nominal Supply Voltage / Vsup (V): 4.5

Stable supply voltage for consistent performance.

Load Capacitance (CL): 50 pF

Optimal load capacitance for reliable operation.

Power Supplies (V): 2/6

Compatible with multiple power supply options for flexibility in usage.

No. of Terminals: 16

Sufficient terminals for connecting to external components.

Maximum I (ol): 5.2 Amp

High output current capability for driving external loads.

Propagation Delay (tpd): 295 ns

Balanced propagation delay for efficient arithmetic computations.

Maximum Operating Temperature: 125 °C

Wide operating temperature range for versatility in different environments.

Minimum Operating Temperature: -55 °C

Suitable for use in extreme temperature conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Durable terminal finish for long-lasting performance.

Terminal Position: DUAL

Dual terminal position for increased versatility in circuit board layout.

Maximum Seated Height: 1.2 mm

Low profile design for compact installations.

Width: 4.4 mm

Narrow width for efficient use of space on circuit boards.

Output Polarity: TRUE

Consistent output polarity for accurate arithmetic results.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage requirement for energy efficiency.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for manufacturing processes.

Length: 5 mm

Compact length for space-saving installation.

Temperature Grade: MILITARY

Military-grade temperature tolerance for rugged applications.

Technology: CMOS

CMOS technology for efficient and low-power arithmetic operations.

Terminal Form: GULL WING

Gull wing terminal form for secure connections.

Packing Method: TR

Tape and reel packing method for easy handling and storage.

Terminal Pitch: 0.65 mm

Fine terminal pitch for precise connections.

Maximum Supply Voltage (Vsup): 6 V

High maximum supply voltage for versatility in power sources.

Maximum Power Supply Current (ICC): 0.08 mA

Low power supply current requirement for energy efficiency.

Technical Specifications

Digital Arithmetic Circuits CD74HC85PWTE4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE, THREE POSSIBLE OUTPUTS ARE AB

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

42 ns

Propagation Delay (tpd):

295 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

CD74HC85PWTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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