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TP4582AJ

Texas Instruments

TP4582AJ by Texas Instruments

TP4582AJ by Texas Instruments is a CMOS digital arithmetic circuit with 16 terminals in an IN-LINE rectangular ceramic package. It operates b/w -40°C to 85°C, suitable for industrial applications requiring precise calculations and data processing. The through-hole terminal form with 2.54mm pitch ensures reliable connections in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,345 parts In-Stock

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3,345

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Vyrian

USA . 2,724 parts In-Stock

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2,724

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Distributors (Availability)

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Andel Nordic

Denmark . 1,621 parts In-Stock

1+ parts

$4.981

100+ parts

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$4.782

10k+ parts

$4.782

1,621

$4.981

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$4.782

$4.782

One Stop Electronics

USA . 1,156 parts In-Stock

1+ parts

$6.000

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$6.000

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AZTECH Wire

Italy . 292 parts In-Stock

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$9.461

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292

$9.461

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Parana Technologies

USA . 1,390 parts In-Stock

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$18.577

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$18.679

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1,390

$18.577

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$18.679

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DigiPath Technology Company

USA . 1,380 parts In-Stock

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$20.456

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1,380

$20.456

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ChromeModa Solutions

Germany . 307 parts In-Stock

1+ parts

$20.873

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$17.116

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307

$20.873

$17.116

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IDEA Electronic Components Group

UK . 146 parts In-Stock

1+ parts

$20.873

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$19.829

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$18.786

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146

$20.873

$19.829

$18.786

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Corphita

USA . 2,794 parts In-Stock

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Overview

Discover the innovative TP4582AJ by Texas Instruments, a high-quality digital arithmetic circuit designed to enhance precision and efficiency in industrial applications. With a durable ceramic package body and advanced CMOS technology, this product ensures reliable performance in extreme temperatures. Boasting 16 terminals and a sleek rectangular design, the TP4582AJ offers seamless integration and optimal functionality. Trust Texas Instruments for cutting-edge solutions that deliver value and superior results. Elevate your projects with the TP4582AJ and experience the difference of top-notch engineering.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and stability, ensuring reliable performance even in high temperature environments.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a circuit board, making it easy to integrate this digital arithmetic circuit into various electronic devices.

No. of Terminals: 16

With 16 terminals, this digital arithmetic circuit offers a variety of input and output options, increasing its versatility in different applications.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to connect this digital arithmetic circuit in a linear layout, facilitating efficient signal flow and layout design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this digital arithmetic circuit can withstand elevated temperatures without compromising its performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that this digital arithmetic circuit can function reliably in cold environments as well.

Terminal Position: DUAL

Dual terminal position provides redundancy and reliability in connection, reducing the risk of signal loss or disconnection in critical applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that this digital arithmetic circuit is rugged and durable, suitable for use in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this digital arithmetic circuit energy-efficient and reliable in noisy environments.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections to the circuit board, ensuring durability and stability in various electronic applications.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this digital arithmetic circuit is compatible with standard through-hole PCB layouts, making it easy to integrate into existing designs.

Technical Specifications

Digital Arithmetic Circuits TP4582AJ attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TP4582AJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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