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SN74ALS520J4

Texas Instruments

SN74ALS520J4 by Texas Instruments

SN74ALS520J4 by Texas Instruments is a 20-terminal digital arithmetic circuit with TTL technology. It operates at 5V, suitable for commercial-grade applications. Housed in a ceramic rectangular package, it has an operating temperature range of 0-70°C and terminal pitch of 2.54mm, making it ideal for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,148 parts In-Stock

1+ parts

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4,148

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Digiode

USA . 2,482 parts In-Stock

1+ parts

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2,482

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,084 parts In-Stock

1+ parts

$6.670

100+ parts

-

1k+ parts

$6.403

10k+ parts

$6.403

3,084

$6.670

-

$6.403

$6.403

AZTECH Wire

Italy . 786 parts In-Stock

1+ parts

$7.757

100+ parts

-

1k+ parts

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786

$7.757

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Parana Technologies

USA . 1,533 parts In-Stock

1+ parts

$11.954

100+ parts

-

1k+ parts

$12.361

10k+ parts

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1,533

$11.954

-

$12.361

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DigiPath Technology Company

USA . 1,912 parts In-Stock

1+ parts

$13.163

100+ parts

-

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10k+ parts

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1,912

$13.163

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IDEA Electronic Components Group

UK . 2,311 parts In-Stock

1+ parts

$13.432

100+ parts

$12.760

1k+ parts

$12.089

10k+ parts

-

2,311

$13.432

$12.760

$12.089

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ChromeModa Solutions

Germany . 863 parts In-Stock

1+ parts

$13.432

100+ parts

$11.014

1k+ parts

-

10k+ parts

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863

$13.432

$11.014

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One Stop Electronics

USA . 1,293 parts In-Stock

1+ parts

$57.000

100+ parts

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1,293

$57.000

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Corphita

USA . 2,740 parts In-Stock

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2,740

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Overview

Unlock the power of precision with the SN74ALS520J4 by Texas Instruments. As a leader in digital arithmetic circuits, Texas Instruments delivers quality and reliability in every product. The SN74ALS520J4 offers unmatched performance and efficiency, making it ideal for a wide range of applications. From industrial automation to telecommunications, this versatile component is designed to meet your needs. Trust Texas Instruments to provide the innovative solutions you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its high thermal conductivity and excellent resistance to heat, making it an ideal choice for applications where temperature regulation is important.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V provides a standard power requirement that is easily accessible in many electronic systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product is suitable for use in various environments without overheating.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making this product efficient and reliable for digital arithmetic operations.

Technical Specifications

Digital Arithmetic Circuits SN74ALS520J4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALS520J4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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