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SNJ54F382J-00

Texas Instruments

SNJ54F382J-00 by Texas Instruments

SNJ54F382J-00 by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 10 ns. It operates at a supply voltage range of 4.5V to 5.5V and has a temperature grade of MILITARY, suitable for military applications requiring fast arithmetic calculations in compact spaces. The package style is IN-LINE, making it ideal for through-hole mounting in harsh environments with temperatures ranging from -55°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,334 parts In-Stock

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3,334

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Digiode

USA . 1,283 parts In-Stock

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1,283

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Distributors (Availability)

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Andel Nordic

Denmark . 1,486 parts In-Stock

1+ parts

$2.963

100+ parts

-

1k+ parts

$2.845

10k+ parts

$2.845

1,486

$2.963

-

$2.845

$2.845

AZTECH Wire

Italy . 242 parts In-Stock

1+ parts

$16.809

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242

$16.809

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Parana Technologies

USA . 48 parts In-Stock

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$22.686

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$23.352

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48

$22.686

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$23.352

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DigiPath Technology Company

USA . 340 parts In-Stock

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$24.980

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340

$24.980

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ChromeModa Solutions

Germany . 635 parts In-Stock

1+ parts

$25.490

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$20.902

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635

$25.490

$20.902

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IDEA Electronic Components Group

UK . 110 parts In-Stock

1+ parts

$25.490

100+ parts

$24.216

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$22.941

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110

$25.490

$24.216

$22.941

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One Stop Electronics

USA . 1,590 parts In-Stock

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$62.000

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$62.000

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Corphita

USA . 4,826 parts In-Stock

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4,826

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Overview

Enhance your digital arithmetic circuits with the high-quality SNJ54F382J-00 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable and innovative solutions for various applications. This rectangular package with a ceramic, glass-sealed body offers 4 bits of precision with a fast propagation delay of 10 ns. With a wide operating temperature range and military-grade technology, this product ensures top performance in demanding environments. Upgrade your projects with the SNJ54F382J-00 and experience the unparalleled value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent protection for the internal components, making the product durable and reliable.

No. of Bits: 4

Having 4 bits allows for precise calculations and accurate results in digital arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures efficient performance and compatibility with standard power sources.

Propagation Delay (tpd): 10 ns

The low propagation delay of 10ns enables fast processing speeds and reduces latency in arithmetic calculations.

Temperature Grade: MILITARY

Designed to withstand extreme temperatures, making it suitable for military and rugged environments where reliability is crucial.

Technical Specifications

Digital Arithmetic Circuits SNJ54F382J-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 3 LOGIC & ARITHMETIC OPERATIONS; OVERFLOW OUTPUT FOR 2'S COMPLEMENT ARITHMETIC

Family:

F/FAST

JESD-30 Code:

R-GDIP-T20

Length:

24.195 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SNJ54F382J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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